AT88RF1354_09 ATMEL [ATMEL Corporation], AT88RF1354_09 Datasheet - Page 22

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AT88RF1354_09

Manufacturer Part Number
AT88RF1354_09
Description
13.56 MHz Type B RF Reader Specification
Manufacturer
ATMEL [ATMEL Corporation]
Datasheet
8.
8.1.
8.2.
8.3.
22
Mechanical
Thermal Characteristics
The AT88RF1354 QFN package thermal characteristics were modeled and characterized by Amkor with JEDEC
standard methods using a multilayer JEDEC test board with nine thermal vias on the PCB thermal pad.
°C/W and θ
Since
measures heat transfer between the QFN and stagnant air.
Moisture Sensitivity
The AT88RF1354 QFN package is qualified to JEDEC MSL3.
Composition
The AT88RF1354 QFN package is a lead-free and halogen-free green package.
13.56 MHz Type B RF Reader Specification
ψ
JB
measures the heat transfer between the QFN package and the PC board, it is more relevant than θ
JA
is 30.9 °C/W for this package.
ψ
8547B–RFID–3/09
JB
is 12.1
JA
. θ
JA

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