AT88RF1354_09 ATMEL [ATMEL Corporation], AT88RF1354_09 Datasheet - Page 16

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AT88RF1354_09

Manufacturer Part Number
AT88RF1354_09
Description
13.56 MHz Type B RF Reader Specification
Manufacturer
ATMEL [ATMEL Corporation]
Datasheet
6.
6.1.
6.2.
6.2.1. Operating Voltage
16
Electrical Characteristics
Absolute Maximum Ratings*
DC Characteristics
T
Note:
13.56 MHz Type B RF Reader Specification
Operating Temperature (case temp).........−40°C to +85°C
Storage Temperature (case temp) .........−65°C to + 150°C
Power Dissipation .................................................. 2 Watts
Maximum Operating Voltage (V
Maximum Operating Voltage (V
DC Current: V
DC Current: V
HBM ESD................................................ 2000 V minimum
C
V
V
Symbol
CC
CC
= -40° to +85° C (unless otherwise noted)
_ANT
1. Power is required to be applied to both V
2. V
3. V
4. AT88RF1354 does not support hot swapping or hot plugging. Connecting or disconnecting this device to a
power is not applied to both the V
permanently damaged.
system while power is energized can cause permanent damage to AT88RF1354.
Supply voltage
Supply voltage, antenna driver
CC
CC
CC
SS
, V
Pin ...............................................100 mA
_ANT Pin.....................................300 mA
and V
SS
A, V
CC
Parameter
_ANT are not required to be set to the same voltage.
SS
_ANT, and the ePad must all be externally connected to ground or the device will be
CC
CC
) ...................... 6.0 Volts
_ANT) ............ 6.0 Volts
5 Volt Digital interface
3.3 Volt Digital Interface
High Output Power
Low Output Power
CC
pin and the V
CC
Condition
and V
*
Warning
Notice:
CC
CC
_ANT pin the device will be permanently damaged.
_ANT within the specified operating voltage ranges. If
:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only and
functional operation of the device at these or any
other condition beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
This product package includes an integrated
(exposed thermal pad) heatsink that must be
soldered to the printed circuit board; failure to
adequately heatsink this product will affect device
reliability.
Min
4.5
3.0
4.5
3.0
Nominal
5.0
3.3
5.0
3.3
Max
5.5
3.6
5.5
3.6
8547B–RFID–3/09
Units
V
V
V
V

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