M58BW16FB4T3 STMICROELECTRONICS [STMicroelectronics], M58BW16FB4T3 Datasheet - Page 61

• Manufacturer Part Number: M58BW16FB4T3
• Description: 16 or 32 Mbit (x32, Boot Block, Burst) 3.3V supply Flash memories
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M58BW16F, M58BW32F
8
Package mechanical
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 22. LBGA80 10 × 12mm - 8 × 10 ball array, 1mm pitch, bottom view package
1. Drawing is not to scale.
E
outline
E1
FE
BALL "A1"
FD
A
e
SD
D1
D
b
SE
e
A1
A2
Package mechanical
BGA-Z05
ddd
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