STTS2002_11 STMICROELECTRONICS [STMicroelectronics], STTS2002_11 Datasheet - Page 39

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STTS2002_11

Manufacturer Part Number
STTS2002_11
Description
2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
STTS2002
6
6.1
6.1.1
6.1.2
Use in a memory module
In the Dual In line Memory Module (DIMM) application, the SPD is soldered directly on to
the printed circuit module. The three chip enable inputs (A0, A1, A2) must be connected to
V
socket (see
Table 27.
Programming the SPD
The situations in which the SPD EEPROM is programmed can be considered under two
headings:
DIMM isolated
With specific programming equipment, it is possible to define the SPD EEPROM content,
using byte and page write instructions, and its write-protection using the SWP and CWP
instructions. To issue the SWP and CWP instructions, the DIMM must be inserted in the
application-specific slot where the A0 signal can be driven to V
instruction. This programming step is mainly intended for use by DIMM makers, whose end
application manufacturers will want to clear this write-protection with the CWP on their own
specific programming equipment, to modify the lower 128 bytes, and finally to set
permanently the write-protection with the PSWP instruction.
DIMM inserted in the application motherboard
As the final application cannot drive the A0 pin to V
the write-protection with the PSWP instruction.
SS
or V
when the DIMM is isolated (not inserted on the PCB motherboard)
when the DIMM is inserted on the PCB motherboard
DIMM position
DD
directly (that is without using a pull-up or pull-down resistor) through the DIMM
Table
DRAM DIMM connections
0
1
2
3
4
5
6
7
27).
Doc ID 15389 Rev 5
V
V
V
V
V
V
V
V
SS
SS
SS
DD
DD
DD
DD
SS
A2
(0)
(0)
(0)
(0)
(1)
(1)
(1)
(1)
HV
, the only possible action is to freeze
V
V
V
V
V
V
V
V
DD
DD
DD
DD
SS
SS
SS
SS
A1
(0)
(0)
(1)
(1)
(0)
(0)
(1)
(1)
HV
Use in a memory module
during the whole
V
V
V
V
V
V
V
V
DD
DD
DD
SS
SS
SS
SS
DD
A0
(1)
(0)
(1)
(0)
(0)
(1)
(0)
(1)
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