DSPIC30F MICROCHIP [Microchip Technology], DSPIC30F Datasheet - Page 231

• Manufacturer Part Number: DSPIC30F
• Description: General Purpose and Sensor Families High-Performance Digital Signal Controllers
• Manufacturer: MICROCHIP [Microchip Technology]

28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
 2004 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
B
c
p
n
45°
β
E1
E
Dimension Limits
h
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
α
2
1
φ
β
D
L
MIN
Preliminary
φ
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
28
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
NOM
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
dsPIC30F
28
12
12
4
α
DS70083G-page 229
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8