DSPIC30F MICROCHIP [Microchip Technology], DSPIC30F Datasheet - Page 247

• Manufacturer Part Number: DSPIC30F
• Description: General Purpose and Sensor Families High-Performance Digital Signal Controllers
• Manufacturer: MICROCHIP [Microchip Technology]

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
 2004 Microchip Technology Inc.
Examples:
a) dsPIC30F2011AT-E/SO = Extended temp., SOIC package, Rev. A.
b) dsPIC30F5011AT-I/PT = Industrial temp., TQFP package, Rev. A.
c) dsPIC30F3012AT-I/P = Industrial temp., DIP package, Rev. A.
Architecture
Trademark
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 4 0 1 3 AT- 3 0 I / P - E S
Preliminary
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Package
PT = TQFP 10x10
PT = TQFP 12x12
PF = TQFP 14x14
P
SO = SOIC
SP = SPDIP
ML = QFN 6x6 or 8x8
S
W
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
dsPIC30F
= DIP
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
DS70083G-page 245
Speed
20 = 20 MIPS
30 = 30 MIPS