DSPIC30F MICROCHIP [Microchip Technology], DSPIC30F Datasheet - Page 238

• Manufacturer Part Number: DSPIC30F
• Description: General Purpose and Sensor Families High-Performance Digital Signal Controllers
• Manufacturer: MICROCHIP [Microchip Technology]

dsPIC30F
80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70083G-page 236
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092
c
B
β
p
#leads=n1
Dimension Limits
E1
E
Units
CH
A2
(F)
D1
n1
A1
E1
E
D
B
n
p
A
L
c
α
φ
β
n
MIN
Preliminary
.037
.002
.018
.
.004
.009
2
1
D1
11
11
0
L
φ
CH x 45 °
INCHES
D
NOM
A1
.026
.039
.024
.039
.551
.551
.013
.630
.630
80
20
A
MAX
.047
.006
.030
.008
.041
.015
13
13
7
(F)
MIN
0.95
0.05
0.45
0.09
0.22
11
11
0
MILLIMETERS*
 2004 Microchip Technology Inc.
NOM
16.00
16.00
14.00
14.00
0.65
1.00
0.60
1.00
0.32
80
20
MAX
A2
α
1.20
1.05
0.15
0.75
0.20
0.38
13
13
7