MC9328MXL ETC, MC9328MXL Datasheet - Page 81

• Manufacturer Part Number: MC9328MXL
• Description: i.MX Integrated Portable System Processor
• Manufacturer: ETC

4.1 MAPBGA 256 Package Dimensions
Figure 63 illustrates the 256 MAPBGA 14 mm × 14 mm × 1.30 mm package, which has 0.8 mm spacing between
the pads. The device designator for the MAPBGA package is VH.
Freescale Semiconductor
NOTES:
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ALL DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14 5M-1994.
MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
DATUM A, THE SEATING PLANE IS DEFINED BY SPHERICAL CROWNS OF THE SOLDER BALLS.
BOTTOM VIEW
Figure 63. MC9328MXL 256 MAPBGA Mechanical Drawing
TOP VIEW
MC9328MXL Advance Information, Rev. 5
Case Outline 1367
Pin-Out and Package Information
SIDE VIEW
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