UPB587G NEC, UPB587G Datasheet - Page 14

• Manufacturer Part Number: UPB587G
• Description: 1GHz INPUT DIVIDE BY 2/ 4/ 8 PRESCALER IC FOR PORTABLE SYSTEMS
• Manufacturer: NEC

NOTE ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the
recommended conditions are to be consulted with our sales representatives.
P P P P PB1509GV
14
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1000 pF) to the V
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
* It is the storage days after opening a dry pack, the storage conditions are 25qC, less than 65% RH.
Infrared ray reflow
VPS
Wave soldering
Pin part heating
Soldering method
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Package peak temperature: 235qC,
Hour: within 30 s. (more than 210qC),
Time: 3 times, Limited days: no.*
Package peak temperature: 215qC,
Hour: within 40 s. (more than 200qC),
Time: 3 times, Limited days: no.*
Soldering tub temperature: less than 260qC,
Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin area temparature: less than 300qC,
Hour: within 3 s./pin
Limited days: no.*
Soldering conditions
CC
pin.
condition symbol
Recommended
WS60-00-1
VP15-00-3
IR35-00-3
P P P P PB1509GV