AM29F200A-1 AMD [Advanced Micro Devices], AM29F200A-1 Datasheet - Page 7

• Manufacturer Part Number: AM29F200A-1
• Description: 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 5.0 Volt-only, Sectored Flash Memory-Die Revision 1
• Manufacturer: AMD [Advanced Micro Devices]

PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . . . . . . 191 mils x 174 mils
Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils
Bond Pad Size . . . . . . . . . . . . . . 4.55 mils x 4.55 mils
Pad Area Free of Passivation . . . . . . . . . .20.70 mils
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
V
Junction Temperature Under Bias . .T
Operating Temperature
1/13/98
. . . . . . . . . . . . . . . . . . . . . . . . . . . 4.85 mm x 4.42 mm
. . . . . . . . . . . . . . . . . . . . . . . . . . 115.6 m x 115.6 m
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13,363 m
CC
Commercial . . . . . . . . . . . . . . . . . . . 0 C to +70 C
Industrial . . . . . . . . . . . . . . . . . . . –40 C to +85 C
Extended . . . . . . . . . . . . . . . . . . –55 C to +125 C
(Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V
may be grounded (optional)
J
(max) = 130 C
Am29F200A Known Good Die
S U P P L E M E N T
2
2
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC
Manufacturing ID (Top Boot) . . . . . . . . . . . . 98483AK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . CS29AF
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250 C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30 C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
(Bottom Boot) . . . . . . . .98483ABK
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