AM29LV128MH AMD [Advanced Micro Devices], AM29LV128MH Datasheet - Page 61

• Manufacturer Part Number: AM29LV128MH
• Manufacturer: AMD [Advanced Micro Devices]

PHYSICAL DIMENSIONS
TS056/TSR056—56-Pin Standard/Reverse Thin Small Outline Package (TSOP)
September 9, 2003
PACKAGE
SYMBOL
JEDEC
D1
A1
A2
b1
c1
O
A
b
D
E
e
L
R
N
c
19.90
18.30
13.90
MIN.
0.05
0.95
0.17
0.17
0.10
0.10
0.50
0.08
---
0˚
MO-142 (B) EC
0.50 BASIC
TS/TSR 56
NOM.
20.00
18.40
14.00
1.00
0.20
0.22
0.60
---
---
---
---
---
56
3˚
MAX.
20.20
18.50
14.10
1.20
0.15
1.05
0.23
0.27
0.16
0.21
0.70
0.20
5˚
D A T A S H E E T
NOTES:
1
2
3
4
5
6
7
8.
9
Am29LV128MH/L
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
MOLD PROTUSION IS 0.15 mm PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE
DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b
DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.
THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10 mm AND 0.25 mm FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
3160\38.10A
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