NBSG86AMNG ON Semiconductor, NBSG86AMNG Datasheet - Page 13

• Manufacturer Part Number: NBSG86AMNG
• Description: IC SMART GATE SIGE DIFF 16QFN
• Manufacturer: ON Semiconductor

Specifications of NBSG86AMNG

• Logic Type: Configurable Multiple Function
• Number Of Circuits: 2
• Number Of Inputs: 2
• Schmitt Trigger Input: No
• Output Type: Differential
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TFQFN Exposed Pad
• Product: MUX Gates
• High Level Output Current: - 25 mA
• Low Level Output Current: 25 mA
• Propagation Delay Time: 0.215 ns
• Supply Voltage (max): +/- 3.465 V
• Supply Voltage (min): +/- 2.375 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NBSG86AMNGOS

LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
-Y-
3 X
E
A
e
0.20
S
A2
-X-
ROTATED 90 CLOCKWISE
A1
VIEW M-M
4
DETAIL K
3
D
_
4
2
PLASTIC 4 X 4 (mm) BGA FLIP CHIP PACKAGE
1
A
B
C
D
0.10 Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
16 X
16 X
PACKAGE DIMENSIONS
3
5
0.15 Z
b
http://onsemi.com
0.15
0.08
-Z-
CASE 489-01
BA SUFFIX
FCBGA-16
NBSG86A
M
M
ISSUE O
K
Z
Z
13
X
M
M
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
PER ASME Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A1
A2
A
b
D
E
e
S
MILLIMETERS
MIN
0.25
0.30
1.40 MAX
1.20 REF
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
MAX
0.35
0.50