NBSG86AMNG ON Semiconductor, NBSG86AMNG Datasheet - Page 15

• Manufacturer Part Number: NBSG86AMNG
• Description: IC SMART GATE SIGE DIFF 16QFN
• Manufacturer: ON Semiconductor

Specifications of NBSG86AMNG

• Logic Type: Configurable Multiple Function
• Number Of Circuits: 2
• Number Of Inputs: 2
• Schmitt Trigger Input: No
• Output Type: Differential
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TFQFN Exposed Pad
• Product: MUX Gates
• High Level Output Current: - 25 mA
• Low Level Output Current: 25 mA
• Propagation Delay Time: 0.215 ns
• Supply Voltage (max): +/- 3.465 V
• Supply Voltage (min): +/- 2.375 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NBSG86AMNGOS

PUBLICATION ORDERING INFORMATION
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ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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16 X
0.10 C
0.05 C
NOTE 5
16X
16X
LOCATION
0.10 C
0.08 C
0.15 C
K
PIN 1
L
0.15 C
NOTE 3
A B
16X
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
Ç Ç
Ç Ç
Ç Ç
4
1
16
BOTTOM VIEW
SIDE VIEW
TOP VIEW
5
D2
D
e
13
8
(A3)
12
9
EXPOSED PAD
A1
e
A
B
E
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: [phone]
Japan Customer Focus Center
Phone: [phone]
PACKAGE DIMENSIONS
E2
A
http://onsemi.com
CASE 485G-01
C
16 PIN QFN
NBSG86A
SEATING
PLANE
ISSUE C
15
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.575
0.022
0.128
3.25
SOLDERING FOOTPRINT*
NOTES:
0.012
0.30
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. L
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
0.128
DIM
A1
A3
D2
E2
3.25
max
A
D
E
K
b
e
L
CONDITION CAN NOT VIOLATE 0.2 MM
MILLIMETERS
0.80
0.00
0.18
1.65
1.65
0.30
MIN
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.18 TYP
0.50
0.02
MAX
1.00
0.05
0.30
1.85
1.85
0.50
SCALE 10:1
EXPOSED PAD
0.059
1.50
NBSG86A/D
0.012
0.30
inches
mm