GS8182D19BGD-400 GSI Technology, GS8182D19BGD-400 Datasheet

no-image

GS8182D19BGD-400

Manufacturer Part Number
GS8182D19BGD-400
Description
BGA 165/SYNCHRONOUS SRAM's 1M x 18 (18 Meg) Burst of 4
Manufacturer
GSI Technology
Datasheet

Specifications of GS8182D19BGD-400

Pack_quantity
144
Comm_code
85423245
Lead_time
70
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• 2.0 Clock Latency
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• Data Valid Pin (QVLD)
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
SigmaQuad™ Family Overview
The GS8182D19/37D are built in compliance with the
SigmaQuad-II+ SRAM pinout standard for Separate I/O
synchronous SRAMs. They are 18,874,368-bit (18Mb)
SRAMs. The GS8182D19/37D SigmaQuad SRAMs are just
one element in a family of low power, low voltage HSTL I/O
SRAMs designed to operate at the speeds needed to implement
economical high performance networking systems.
Rev: 1.00a 6/2008
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
tKHKH
tKHQV
0.45 ns
2.5ns
-400
Parameter Synopsis
1/29
18Mb SigmaQuad-II+
Burst of 4 SRAM
2.67 ns
0.45 ns
-375
Clocking and Addressing Schemes
The GS8182D19/37D SigmaQuad-II+ SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer.
Because Separate I/O SigmaQuad-II+ Burst of 4 RAMs always
transfer data in four packets, A0 and A1 are internally set to 0
for the first read or write transfer, and automatically
incremented by 1 for the next transfers.
1 mm Bump Pitch, 11 x 15 Bump Array
0.45 ns
3.3 ns
165-Bump, 13 mm x 15 mm BGA
-333
GS8182D19/37BD-400/375/333/300
Bottom View
0.45 ns
3.0 ns
-300
© 2008, GSI Technology
1.8 V and 1.5 V I/O
400 MHz–300 MHz
Preliminary
1.8 V V
DD

Related parts for GS8182D19BGD-400

Related keywords