M36L0R7050L1 STMICROELECTRONICS [STMicroelectronics], M36L0R7050L1 Datasheet - Page 19

• Manufacturer Part Number: M36L0R7050L1
• Description: 128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M36L0R7060U1, M36L0R7060L1, M36L0R7050U1, M36L0R7050L1
6
Package mechanical
Figure 6.
1. Drawing is not to scale.
Table 6.
Symbol
FE1
ddd
SD
D1
FD
FE
SE
A1
A2
E1
E2
A
D
E
b
e
TFBGA88 8 × 10mm, 8 × 10 ball array - 0.8mm pitch, bottom view package
outline
Stacked TFBGA88 8 × 10mm - 8 × 10 active ball array, 0.8mm pitch,
package data
10.000
0.850
0.350
8.000
5.600
7.200
8.800
0.800
1.200
1.400
0.600
0.400
0.400
Typ
E
E2
E1
FE
millimeters
BALL "A1"
FE1
0.200
0.300
7.900
9.900
SE
Min
A
–
FD
10.100
D1
D
1.200
0.400
8.100
0.100
Max
–
SD
A1
0.3937
0.0335
0.0138
0.3150
0.2205
0.2835
0.3465
0.0315
0.0472
0.0551
0.0236
0.0157
0.0157
e
b
Typ
A2
inches
0.0079
0.0118
0.3110
0.3898
Package mechanical
Min
BGA-Z42
ddd
–
0.0472
0.0157
0.3189
0.0039
0.3976
Max
–
19/22