M36L0R7050L1 STMICROELECTRONICS [STMicroelectronics], M36L0R7050L1 Datasheet - Page 20

• Manufacturer Part Number: M36L0R7050L1
• Description: 128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Part numbering
7
Note:
20/22
Part numbering
Table 7.
Devices are shipped from the factory with the memory content bits, in valid blocks, erased to
’1’. For further information on any aspect of this device, please contact your nearest ST
Sales Office.
Example:
Device Type
M36 = Multi-Chip Package (Flash + RAM)
Flash 1 Architecture
L = Multi-Level, Multiple Bank, Burst Mode
Flash 2 Architecture
0 = No Die
Operating Voltage
R = V
Flash 1 Density
7 = 128 Mbit
Flash 2 Density
0 = No Die
RAM 1 Density
5 = 32 Mbit
6 = 64 Mbit
RAM 2 Density
0 = No Die
Parameter Block Location
U = Top Boot Block Flash
L = Bottom Boot Block Flash
Product Version
1 = 0.13µm Flash technology and multilevel design, 85ns speeds;
RAM, 70ns speed Mux I/O
Package
ZAM = Stacked TFBGA88 8x10mm - 8x10 active ball array, 0.8mm pitch
Packing Option
E = ECOPACK® Package, Standard Packing
F = ECOPACK® Package, Tape & Reel Packing
DDF
= V
DDP
Part numbering scheme
= V
DDQF
M36L0R7060U1, M36L0R7060L1, M36L0R7050U1, M36L0R7050L1
= 1.7V to 1.95V
M36 L 0 R 7 0 5 0 L 1 ZAM F