S72NS-N SPANSION [SPANSION], S72NS-N Datasheet
S72NS-N
Related parts for S72NS-N
S72NS-N Summary of contents
Page 1
... S72NS-N Based MCPs Stacked Multi-Chip Product (MCP) MirrorBit 128 bit)/256 Mb ( bit), 110nm CMOS 1.8 Volt-only, Multiplexed, Simultaneous Read/Write, Burst Mode Flash Memory and 128/256-Mb (8/16-M x 16-bit) DDR DRAM Data Sheet Notice to Readers: The Advance Information status indicates that this document contains information on one or more products under development at Spansion LLC ...
Page 2
... Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office S72NS128/256ND0 Based MCPs range. Changes IO S72NS128_256ND0_00_B1 November 9, 2005 ...
Page 3
... DDR DRAM Data Sheet General Description This document contains information on the S72NS-N MCP product family. Refer to the S29NS-N data sheet (S29NS256/128N_01, revision A4) for full electrical specifications of the Flash memory component. Refer to the DDR SDRAM Type 1 data sheet (revision A2) for full electrical specifica- tions of the DDR SDRAM component ...
Page 4
... MCP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 5.2 NLE133—133-ball Fine-Pitch Ball Grid Array (FBGA) 8.0 x 8.0 x 1.0 mm MCP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.3 MTA133—133-ball Fine-Pitch Ball Grid Array (FBGA) 10.0 x 11.0 x 1.0 mm MCP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 6 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . S72NS-N Based MCPs S72NS128_256ND0_00_B1 November 9, 2005 ...
Page 5
... CAS# DQS0 BA0 DQS1 DDR LDQM BA1 DRAM UDQM CKE Memory TEST WE# DQ15-DQ0 V V SSQ CCQ Figure 1.1. MCP Block Diagram S72NS-N Based MCPs ADQ15-ADQ0 F-CLK F-RDY A16-Amax F F-V CCQ D-CLK D-CLK# D-LDQS D-UDQS D-LDQM D-UDQM D-TEST D-DQ15 - D-DQ0 D D-V SSQ ...
Page 6
... D-A5 D-A8 D-CAS# D-CLK# D-BA1 D-A11 D-A4 D-A7 D-RAS# D-CLK D-VCC D-BA0 S72NS-N Based MCPs A13 A14 A10 A11 A12 D-DQ5 D-DQ3 D-VSSQ DNU DNU Do Not Use B14 B10 B11 B12 B13 D-DQ6 D-DQ4 D-DQ1 D-VCCQ DNU C10 C11 ...
Page 7
... D-A5 D-A8 D-CAS# D-CLK# D-BA1 D-A11 D-A4 D-A7 D-RAS# D-CLK D-VCC D-BA0 S72NS-N Based MCPs A13 A14 A10 A11 A12 D-DQ5 D-DQ3 D-VSSQ DNU DNU Do Not Use B14 B10 B11 B12 B13 D-DQ6 D-DQ4 D-DQ1 D-VCCQ DNU C10 C11 ...
Page 8
... D-A5 D-A8 D-CAS# D-CLK# D-BA1 D-A11 D-A4 D-A7 D-RAS# D-CLK D-VCC D-BA0 S72NS-N Based MCPs A13 A14 A10 A11 A12 D-DQ5 D-DQ3 D-VSSQ DNU DNU Do Not Use B14 B10 B11 B12 B13 D-DQ6 D-DQ4 D-DQ1 D-VCCQ DNU C10 C11 ...
Page 9
... D-A5 D-A8 D-CAS# D-CLK# D-BA1 D-A11 D-A4 D-A7 D-RAS# D-CLK D-VCC D-BA0 S72NS-N Based MCPs A13 A14 A10 A11 A12 D-DQ3 D-VSSQ DNU DNU Do Not Use B14 B10 B11 B12 B13 D-DQ4 D-DQ1 D-VCCQ DNU C10 C11 C12 C13 ...
Page 10
... Reserved for Future Use = No Connect. Can be connected to ground or left floating. = Internal Test mode pin for DDR DRAM only. Do not apply any signal on this pin. Can be connected to ground or left floating. S72NS-N Based MCPs OL = for asynchronous mode device ignores address IH = device resets and returns to ...
Page 11
... D0 AF Valid Combinations list configurations planned to be supported in vol- ume for this device. Consult your local sales office to confirm avail- ability of specific valid combinations and to check on newly released combinations. S72NS-N Based MCPs ° C) Technology TM Package Model Packing Modifier Number ...
Page 12
... BALL PITCH 8. SOLDER BALL PLACEMENT DEPOPULATED SOLDER BALLS CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK S72NS-N Based MCPs DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. ALL DIMENSIONS ARE IN MILLIMETERS. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010. e REPRESENTS THE SOLDER BALL GRID PITCH. ...
Page 13
... BALL HEIGHT 0.82 BODY THICKNESS 8.10 BODY SIZE 8.10 BODY SIZE MATRIX FOOTPRINT MATRIX FOOTPRINT MATRIX SIZE D DIRECTION MATRIX SIZE E DIRECTION BALL COUNT 0.35 BALL DIAMETER BALL PITCH BALL PITCH SOLDER BALL PLACEMENT S72NS-N Based MCPs ...
Page 14
... BODY SIZE MATRIX FOOTPRINT MATRIX FOOTPRINT MATRIX SIZE D DIRECTION MATRIX SIZE E DIRECTION BALL COUNT MAXIMUM NUMBER OF BALLS NUMBER OF LAND PERIMETERS 0.35 BALL DIAMETER BALL PITCH BALL PITCH SOLDER BALL PLACEMENT DEPOPULATED SOLDER BALL S72NS-N Based MCPs D1 PIN A1 eD CORNER ...
Page 15
... Guide table. Connection Diagrams New 128 Mb Flash + 128 Mb DDR SDRAM Pinout added. Ordering Information New valid combinations added to the table. Physical Dimensions New illustration for 8.0 x 8.0 x 1.0 mm MCP Package added. November 9, 2005 S72NS128_256ND0_00_B1 S72NS-N Based MCPs 13 ...
Page 16
... Electrical Characteristics and Recommended AC Operating Conditions table Removed t parameter REFC SDRAM Type 5 Revision Summary Revision A0 (September 30, 2005) Initial release. New SDRAM module PP. values from 40 µ µA. CC6 range from 1.7 V-1 1.7 V-1.95 V S72NS-N Based MCPs S72NS128_256ND0_00_B1 November 9, 2005 ...
Page 17
... Copyright © 2005 Spansion. All rights reserved. Spansion, the Spansion logo, MirrorBit, combinations thereof, and ExpressFlash are trademarks of Spansion. Other company and product names used in this publication are for identification purposes only and may be trademarks of their respective companies. November 9, 2005 S72NS128_256ND0_00_B1 S72NS-N Based MCPs 15 ...