S72NS-P SPANSION [SPANSION], S72NS-P Datasheet

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S72NS-P

Manufacturer Part Number
S72NS-P
Description
MirrorBit Flash Memory and DRAM
Manufacturer
SPANSION [SPANSION]
Datasheet
S72NS-P Based MCPs/PoPs
MirrorBit
128/256/512 Mb (8/16/32 M x 16 bit), 1.8 Volt-only,
Multiplexed Simultaneous Read/Write, Burst Mode Flash
Memory
128/256 Mb (8/16 M x 16 bit) DDR DRAM on Split Bus
Data Sheet (Advance Information)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Flash Memory and DRAM
Publication Number S72NS-P_00
Notice On Data Sheet Designations
Revision 01
Issue Date September 6, 2006
for definitions.
S72NS-P Based MCPs/PoPs Cover Sheet

Related parts for S72NS-P

S72NS-P Summary of contents

Page 1

... Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Publication Number S72NS-P_00 Notice On Data Sheet Designations Revision 01 Issue Date September 6, 2006 S72NS-P Based MCPs/PoPs Cover Sheet for definitions. ...

Page 2

... Questions regarding these document designations may be directed to your local Spansion sales office range. Changes may also include those needed to clarify a IO S72NS-P Based MCPs/PoPs September 6, 2006 S72NS-P_00-01 ...

Page 3

... DRAM = 133 MHz General Description This document contains information on the S72NS-P MCP stacked products. Refer to the S29NS-P data sheet (S29NS-P_00) for full electrical specifications of the Flash memory component. The S72NS Series is a product line of stacked products (MCPs and PoPs), and consists of: ...

Page 4

... PoP DRAM5 DRAM1 133 8.0 x 8.0mm133-ball MCP DRAM5 DRAM1 133 12.0 x 12.0mm 128-ball PoP DRAM5 DRAM1 133 11.0 x 10.0mm 133-ball MCP DRAM5 DRAM1 133 12.0 x 12.0mm 128-ball PoP DRAM5 DRAM1 133 11.0 x 10.0mm 133-ball MCP DRAM5 DRAM1 133 12.0 x 12.0mm 128-ball PoP DRAM5 S72NS-P_00_01 September 6, 2006 ...

Page 5

... Amax = A24 for NS512P, A23 for NS256P, A22 for NS128P b. Amax = A11 for 128 Mb DDR DRAM c. Amax = A12 for 256Mb DDR DRAM 2. For Flash, A15 - A0 is tied to DQ15 - DQ0. S72NS-P_00_01 September 6, 2006 ( RST# ...

Page 6

... ADQ11 ADQ10 ADQ13 ADQ12 ADQ4 F-VSS F-VSS ADQ5 NC ADQ7 ADQ6 F-VCCQ ADQ15 ADQ14 D- F-RDY F-VSS D-A2 D-A12 NC F-VCC DNU D-A0 D-VCC D-VSS DNU DNU Additional NC Locations A11 Ball F1, Ball E1, Ball N11 A11 Ball E1, Ball N11 A11 Ball N11 A12 N/A S72NS-P_00_01 September 6, 2006 ...

Page 7

... Note: Additional NC locations are in reference to the superset connection diagram shown here. Device OPN S72NS128PD0 S72NS256PD0 S72NS512PD0 S72NS512PE0 S72NS-P_00_01 September 6, 2006 ( Figure 3.2 128-ball Fine-Pitch Ball Grid Array, PoP ...

Page 8

... No Connect. Can be connected to ground or left floating. Do Not Use. This signal must be left floating S72NS-P Based MCPs/PoPs Flash DRAM data invalid device S72NS-P_00_01 September 6, 2006 ...

Page 9

... BGA package marking omits leading “S” and packing type designator from ordering part number. 3. Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. S72NS-P_00_01 September 6, 2006 ( ...

Page 10

... OUTER ROW 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW e/2 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. 3436 \ 16-039.22 \ 12.09.04 S72NS-P_00_01 September 6, 2006 ...

Page 11

... BSC. eD 0.50 BSC 0.25 BSC. D5-D11,E4-E11,F4-F11,G4-G11 DEPOPULATED SOLDER BALLS H4-H11,J4-J11,K4-K11,L4-L11 S72NS-P_00_01 September 6, 2006 ( NOTES: 1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. NOTE 3 ...

Page 12

... WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW e/2 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. 10 OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT. 3561 16 038 S72NS-P_00_01 September 6, 2006 PIN ...

Page 13

... R Øb 0.40 0.45 eE 0.65 BSC. eD 0.65 BSC 0.325 BSC. C3-C16,D3-D16,E3-E16, F3-F16,G3-G16,H3-H16, J3-J16,K3-K16,L3-L16, M3-M16,N3-N16,P3-P16, R3-R16,T3-T16 S72NS-P_00_01 September 6, 2006 ( NOTES MAX NOTE 1.15 PROFILE 4. 0.45 BALL HEIGHT 5. --- ...

Page 14

... Copyright © 2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, and combinations thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners S72NS-P Based MCPs/PoPs S72NS-P_00_01 September 6, 2006 ...

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