LIS3LV02DL_08 STMICROELECTRONICS [STMicroelectronics], LIS3LV02DL_08 Datasheet - Page 46

• Manufacturer Part Number: LIS3LV02DL_08
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package information
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Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK
ECOPACK
Figure 28. LGA-16 mechanical data and package dimensions
®
DIM.
A1
A2
A3
D1
E1
N1
P1
P2
L1
T1
T2
Metal Pad
Detail A
N
R
e
d
h
k
s
i
specifications are available at: www.st.com.
D1
0.180
4.250
7.350
0.965
1.200
MIN.
0.64
0.75
0.45
(4 x)
i
B
k
i
A
C
C
A
A
B
0.220
4.400
7.500
5.000
0.975
0.150
0.050
0.100
0.100
TYP.
0.92
0.65
mm
B
1.0
0.3
2.5
1.2
0.8
0.5
E
P2
MAX.
0.260 0.0071 0.0087 0.0102
4.550 0.1673 0.1732 0.1791
7.650 0.2894 0.2953 0.3012
0.985 0.0380 0.0384 0.0388
1.600 0.0472
0.66
0.85
0.55
0.7
1
E1
Solder mask
opening
0.0252 0.0256 0.0260
0.0295 0.0315 0.0335
0.0177 0.0197 0.0217
MIN.
h
C
k
A
0.0394
0.0118
0.1969
0.0984
0.0472
0.0059
0.0020
0.0039
0.0039
D
TYP.
B
inch
D
k
0.0394
0.0276
0.0630
P1
E
seating plane
MAX.
h
C
A
B
A3
R
A2
A1
i
i
C
Land Grid Array Package
LGA16 (4.4x7.5x1mm)
MECHANICAL DATA
Detail A
N1
e
OUTLINE AND
d
®
16
15
is an ST trademark.
14
1
E
13
2
N
12
3
L1
11
4
e
10
5
6
9
7863679 B
T2
7
8
s
D
LIS3LV02DL
T1
®