MF1ICS2005 NXP [NXP Semiconductors], MF1ICS2005 Datasheet - Page 5

• Manufacturer Part Number: MF1ICS2005
• Description: Sawn bumped 120?m wafer addendum
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
7. References
8. Revision history
Table 4.
141130
Product data sheet
Document ID Release date
141130
Modifications:
Revision history
July 2007
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The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP
Semiconductors.
Legal texts have been adapted to the new company name.
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Data sheet “General wafer specification for 8” wafers”
Data sheet “Standard card IC MF1 IC S50 memory contents after test”
Data sheet “Standard card IC MF1 IC S50 functional Specification”
Product qualification package “Standard card IC MF1 IC S50 05”
Application note “Mifare‚ card IC coil design guide”
Data sheet status
Product data sheet
Rev. 3.0 — 18 July 2007
Sawn bumped 120µm wafer addendum
Change notice
MF1 IC S20 05
© NXP B.V. 2007. All rights reserved.
Supersedes
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