MT46H32M16LFBF-6 L IT:B Micron, MT46H32M16LFBF-6 L IT:B Datasheet - Page 17
![no-image](/images/no-image-200.jpg)
MT46H32M16LFBF-6 L IT:B
Manufacturer Part Number
MT46H32M16LFBF-6 L IT:B
Description
Manufacturer
Micron
Datasheet
1.MT46H32M16LFBF-6LITB.pdf
(98 pages)
- Current page: 17 of 98
- Download datasheet (4Mb)
Figure 8: 90-Ball VFBGA (9mm x 13mm)
PDF: 09005aef82d5d305
512mb_ddr_mobile_sdram_t47m.pdf – Rev. I 12/09 EN
Solder ball
material: SAC105.
Dimensions apply
to solder balls post-
reflow on Ø0.4
SMD ball pads.
90X Ø0.45
Seating
11.2
plane
CTR
0.12 A
0.8 TYP
A
Note:
9 8 7
1. All dimensions are in millimeters.
0.8 TYP
6.4 CTR
9 ±0.1
3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Ball A1 ID
13 ±0.1
0.65 ±0.1
17
512Mb: x16, x32 Mobile LPDDR SDRAM
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Package Dimensions
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
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