GTL2014PW,112 NXP Semiconductors, GTL2014PW,112 Datasheet

IC TXRX 4BIT LVTTL/GTL 14TSSOP

GTL2014PW,112

Manufacturer Part Number
GTL2014PW,112
Description
IC TXRX 4BIT LVTTL/GTL 14TSSOP
Manufacturer
NXP Semiconductors
Datasheet

Specifications of GTL2014PW,112

Logic Type
LVTTL-TO-GTL/GTL+ TRANSCEIVER
Package / Case
14-TSSOP
Logic Function
*
Number Of Bits
4
Input Type
*
Output Type
*
Data Rate
*
Number Of Channels
*
Number Of Outputs/channel
*
Differential - Input:output
*
Propagation Delay (max)
*
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Supply Voltage
3 V ~ 3.6 V
Logic Family
GTL
Number Of Channels Per Chip
4
Input Level
LVTTL
Output Level
GTL
High Level Output Current
- 32 mA
Low Level Output Current
32 mA
Propagation Delay Time
2.8 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 85 C
Function
Bus Transceiver
Input Bias Current (max)
10000 uA
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Polarity
Non-Inverting
Number Of Circuits
4
Operating Supply Voltage (typ)
3.3V
Number Of Elements
1
Input Logic Level
LVTTL/TTL
Output Logic Level
GTL
Package Type
TSSOP
Logical Function
Bus Transceiver
Operating Supply Voltage (min)
3V
Quiescent Current (typ)
4mA
Technology
BiCMOS
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
14
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-3066-5
935277499112
GTL2014PW
1. General description
2. Features
3. Quick reference data
Table 1:
T
Symbol
t
t
t
t
C
C
PLH
PHL
PLH
PHL
amb
i
io
= 25 C
Quick reference data
Parameter
propagation delay; An-to-Bn
propagation delay; Bn-to-An
input capacitance on pin DIR;
A-to-B or B-to-A
input/output capacitance; A-to-B
input/output capacitance; B-to-A
The GTL2014 is a 4-bit translating transceiver designed for 3.3 V LVTTL system interface
with a GTL /GTL/GTL+ bus.
The direction pin allows the part to function as either a GTL to LVTTL sampling receiver or
as a LVTTL to GTL interface.
The GTL2014 LVTTL inputs (only) are tolerant up to 5.5 V allowing direct access to TTL or
5 V CMOS inputs. The LVTTL outputs are not 5.5 V tolerant.
The GTL2014 GTL inputs and outputs operate up to 3.6 V, allowing the device to be used
in higher voltage open-drain output applications.
GTL2014
4-bit LVTTL to GTL transceiver
Rev. 01 — 19 May 2005
Operates as a 4-bit GTL /GTL/GTL+ sampling receiver or as a LVTTL to
GTL /GTL/GTL+ driver
3.0 V to 3.6 V operation with 5 V tolerant LVTTL input
GTL input and output 3.6 V tolerant
V
Partial power-down permitted
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-CC101
Latch-up protection exceeds 500 mA per JESD78
Package offered: TSSOP14
ref
adjustable from 0.5 V to V
Conditions
C
C
V
outputs disabled;
V
I
I
L
L
= 0 V or V
and V
= 50 pF; V
= 50 pF; V
O
= 0 V or 3.0 V
CC
CC
CC
CC
/2
= 3.3 V
= 3.3 V
Min
-
-
-
-
-
-
-
Product data sheet
Typ
2.8
3.4
5.2
4.9
2
4.6
3.4
Max
-
-
-
-
2.5
6.0
4.3
Unit
ns
ns
ns
ns
pF
pF
pF

Related parts for GTL2014PW,112

GTL2014PW,112 Summary of contents

Page 1

GTL2014 4-bit LVTTL to GTL transceiver Rev. 01 — 19 May 2005 1. General description The GTL2014 is a 4-bit translating transceiver designed for 3.3 V LVTTL system interface with a GTL /GTL/GTL+ bus. The direction pin allows the part ...

Page 2

Philips Semiconductors 4. Ordering information Table 2: Type number GTL2014PW Standard packing quantities and other packaging data are available at www.standardics.philips.com/packaging . 4.1 Ordering options Table 3: Type number GTL2014PW 5. Functional diagram Fig 1. Logic diagram for GTL2014 9397 ...

Page 3

Philips Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Pin configuration for TSSOP14 6.2 Pin description Table 4: Symbol DIR VREF GND Functional description Refer to 7.1 Function table ...

Page 4

Philips Semiconductors 8. Limiting values Table 6: In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol ...

Page 5

Philips Semiconductors 9. Recommended operating conditions Table 7: Symbol Parameter ref amb [1] Unused inputs must be held HIGH or LOW to prevent them ...

Page 6

Philips Semiconductors 10. Static characteristics Table 8: Static characteristics Recommended operating conditions; voltages are referenced to GND (ground = 0 V). T Symbol Parameter V HIGH-level output OH voltage V LOW-level output OL voltage I input current I I off-state ...

Page 7

Philips Semiconductors 11. Dynamic characteristics Table 9: Dynamic characteristics V = 3 Symbol Parameter GTL ; 0.9 V ref TT t propagation delay PLH t PHL t ...

Page 8

Philips Semiconductors 11.1 Waveforms ref a. Pulse duration Fig 3. Voltage waveforms Fig 4. Propagation delay 9397 750 13534 Product data sheet 3 ...

Page 9

Philips Semiconductors 12. Test information Fig 5. Load circuitry for switching times Fig 6. Load circuit for B outputs R — Load resistor L C — Load capacitance; includes jig and probe capacitance L R — Termination resistance; should be ...

Page 10

Philips Semiconductors 13. Package outline TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 11

Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

Page 12

Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

Page 13

Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

Page 14

Philips Semiconductors 17. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 15

Philips Semiconductors 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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