GTL2014PW,112 NXP Semiconductors, GTL2014PW,112 Datasheet - Page 13

• Manufacturer Part Number: GTL2014PW,112
• Description: IC TXRX 4BIT LVTTL/GTL 14TSSOP
• Manufacturer: NXP Semiconductors

Specifications of GTL2014PW,112

• Logic Type: LVTTL-TO-GTL/GTL+ TRANSCEIVER
• Package / Case: 14-TSSOP
• Logic Function: *
• Number Of Bits: 4
• Input Type: *
• Output Type: *
• Data Rate: *
• Number Of Channels: *
• Number Of Outputs/channel: *
• Differential - Input:output: *
• Propagation Delay (max): *
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Supply Voltage: 3 V ~ 3.6 V
• Logic Family: GTL
• Number Of Channels Per Chip: 4
• Input Level: LVTTL
• Output Level: GTL
• High Level Output Current: - 32 mA
• Low Level Output Current: 32 mA
• Propagation Delay Time: 2.8 ns
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 85 C
• Function: Bus Transceiver
• Input Bias Current (max): 10000 uA
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Polarity: Non-Inverting
• Number Of Circuits: 4
• Operating Supply Voltage (typ): 3.3V
• Number Of Elements: 1
• Input Logic Level: LVTTL/TTL
• Output Logic Level: GTL
• Package Type: TSSOP
• Logical Function: Bus Transceiver
• Operating Supply Voltage (min): 3V
• Quiescent Current (typ): 4mA
• Technology: BiCMOS
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 14
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3066-5; 935277499112; GTL2014PW

Philips Semiconductors
15. Abbreviations
16. Revision history
Table 12:
9397 750 13534
Product data sheet
Document ID
GTL2014_1
Revision history
Release date
20050519
[4]
[5]
[6]
[7]
[8]
[9]
Table 11:
Acronym
CDM
CMOS
ESD
GTL
HBM
LVTTL
MM
PRR
TTL
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Data sheet status
Product data sheet
Description
Charged Device Model
Complementary Metal Oxide Silicon
ElectroStatic Discharge
Gunning Transceiver Logic
Human Body Model
Low Voltage Transistor-Transistor Logic
Machine Model
Pulse Rate Repetition
Transistor-Transistor Logic
Rev. 01 — 19 May 2005
Change notice
-
Doc. number
9397 750 13534
4-bit LVTTL to GTL transceiver
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Supersedes
-
GTL2014
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