SSTUB32866EC/G,518 NXP Semiconductors, SSTUB32866EC/G,518 Datasheet - Page 2

• Manufacturer Part Number: SSTUB32866EC/G,518
• Description: IC REG BUFFER 25BIT 96-LFBGA
• Manufacturer: NXP Semiconductors

Specifications of SSTUB32866EC/G,518

• Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
• Package / Case: 96-LFBGA
• Supply Voltage: 1.7 V ~ 2 V
• Number Of Bits: 25, 14
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Logic Family: SSTU
• Number Of Circuits: 1
• Maximum Clock Frequency: 450 MHz
• Propagation Delay Time: 1.5 ns
• High Level Output Current: - 8 mA
• Low Level Output Current: 8 mA
• Supply Voltage (max): 2 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.7 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3543-2; 935281279518; SSTUB32866EC/G-T

NXP Semiconductors
4. Ordering information
Table 1.
SSTUB32866_4
Product data sheet
Type number
SSTUB32866EC/G Pb-free (SnAgCu solder
SSTUB32866EC/S
Ordering information
4.1 Ordering options
Solder process
ball compound)
Pb-free (SnAgCu solder
ball compound)
Table 2.
Type number
SSTUB32866EC/G
SSTUB32866EC/S
Ordering options
All information provided in this document is subject to legal disclaimers.
Package
Name
LFBGA96 plastic low profile fine-pitch ball grid array package;
LFBGA96 plastic low profile fine-pitch ball grid array package;
Temperature range
T
T
Rev. 04 — 15 April 2010
amb
amb
= 0 °C to +70 °C
= 0 °C to +85 °C
1.8 V DDR2-800 configurable registered buffer with parity
Description
96 balls; body 13.5 × 5.5 × 1.05 mm
96 balls; body 13.5 × 5.5 × 1.05 mm
SSTUB32866
© NXP B.V. 2010. All rights reserved.
Version
SOT536-1
SOT536-1
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