SSTUM32866EC/S,518 NXP Semiconductors, SSTUM32866EC/S,518 Datasheet - Page 2

• Manufacturer Part Number: SSTUM32866EC/S,518
• Description: IC BUFFER 1.8V 25BIT 96-LFBGA
• Manufacturer: NXP Semiconductors

Specifications of SSTUM32866EC/S,518

• Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 2 V
• Number Of Bits: 25, 14
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Logic Family: SSTU
• Logical Function: Registered Buffer
• Number Of Elements: 1
• Number Of Inputs: 25
• Number Of Outputs: 25
• High Level Output Current: -8mA
• Low Level Output Current: 8mA
• Package Type: LFBGA
• Propagation Delay Time: 3ns
• Operating Supply Voltage (typ): 1.8V
• Operating Supply Voltage (max): 2V
• Operating Supply Voltage (min): 1.7V
• Clock-edge Trigger Type: Posit/Negat-Edge
• Polarity: Non-Inverting
• Technology: CMOS
• Mounting: Surface Mount
• Pin Count: 96
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935284578518; SSTUM32866EC/S-T; SSTUM32866EC/S-T

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
SSTUM32866_1
Product data sheet
Type number
SSTUM32866EC/G Pb-free (SnAgCu solder
SSTUM32866EC/S Pb-free (SnAgCu solder
Ordering information
4.1 Ordering options
Solder process
ball compound)
ball compound)
I
Table 2.
Type number
SSTUM32866EC/G
SSTUM32866EC/S
400 MT/s to 800 MT/s and higher DDR2 registered DIMMs desiring parity checking
functionality
Ordering options
Package
Name
LFBGA96 plastic low profile fine-pitch ball grid array package;
LFBGA96 plastic low profile fine-pitch ball grid array package;
Temperature range
T
T
Rev. 01 — 29 June 2007
amb
amb
= 0 C to +70 C
= 0 C to +85 C
1.8 V DDR2-1G configurable registered buffer with parity
Description
96 balls; body 13.5
96 balls; body 13.5
5.5
5.5
1.05 mm
1.05 mm
SSTUM32866
© NXP B.V. 2007. All rights reserved.
Version
SOT536-1
SOT536-1
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