MAX1301BEUP+CAL Maxim Integrated, MAX1301BEUP+CAL Datasheet - Page 12

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MAX1301BEUP+CAL

Manufacturer Part Number
MAX1301BEUP+CAL
Description
Analog to Digital Converters - ADC Intel R2 Customer special for MAX1301BEUP+
Manufacturer
Maxim Integrated
Datasheet

Specifications of MAX1301BEUP+CAL

Number Of Channels
4/2
Architecture
SAR
Conversion Rate
130 KSPs
Input Type
Single-Ended/Differential
Operating Supply Voltage
4.75 V to 5.25 V
Maximum Power Dissipation
879 mW
Number Of Converters
1
8- and 4-Channel, ±3 x V
Serial 16-Bit ADCs
12
MAX1300 MAX1301
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
______________________________________________________________________________________
PIN
10
11
12
13
14
15
16
17
2
3
4
5
6
7
8
9
REFCAP
DGNDO Digital I/O Ground. DGND, DGNDO, AGND3, AGND2, and AGND1 must be connected together.
DVDDO
AVDD1
SSTRB
NAME
DGND
DOUT
DVDD
SCLK
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
DIN
REF
CS
Analog Supply Voltage 1. Connect AVDD1 to a +4.75V to +5.25V power-supply voltage. Bypass
AVDD1 to AGND1 with a 0.1µF capacitor.
Analog Input Channel 0
Analog Input Channel 1
Analog Input Channel 2
Analog Input Channel 3
Analog Input Channel 4
Analog Input Channel 5
Analog Input Channel 6
Analog Input Channel 7
Active-Low Chip-Select Input. When CS is low, data is clocked into the device from DIN on the
rising edge of SCLK. With CS low, data is clocked out of DOUT on the falling edge of SCLK.
When CS is high, activity on SCLK and DIN is ignored and DOUT is high impedance.
Serial Data Input. When CS is low, data is clocked in on the rising edge of SCLK. When CS is
high, transitions on DIN are ignored.
Serial-Strobe Output. When using the internal clock, SSTRB rising edge transitions indicate that
data is ready to be read from the device. When operating in external clock mode, SSTRB is
always low. SSTRB does not tri-state, regardless of the state of CS, and therefore requires
a dedicated I/O line.
Serial Clock Input. When CS is low, transitions on SCLK clock data into DIN and out of DOUT.
When CS is high, transitions on SCLK are ignored.
Serial Data Output. When CS is low, data is clocked out of DOUT with each falling SCLK
transition. When CS is high, DOUT is high impedance.
Digital Ground. DGND, DGNDO, AGND3, AGND2, and AGND1 must be connected together.
Digital I/O Supply Voltage Input. Connect DVDDO to a +2.7V to +5.25V power-supply voltage.
Bypass DVDDO to DGNDO with a 0.1µF capacitor.
Digital-Supply Voltage Input. Connect DVDD to a +4.75V to +5.25V power-supply voltage.
Bypass DVDD to DGND with a 0.1µF capacitor.
Bandgap-Voltage Bypass Node. For external reference operation, connect REFCAP to AVDD.
For internal reference operation, bypass REFCAP with a 0.01µF capacitor to AGND1
(V
Reference-Buffer Output/ADC Reference Input. For external reference operation, apply an
external reference voltage from 3.800V to 4.136V to REF. For internal reference operation,
bypassing REF with a 1µF capacitor to AGND1 sets V
REFCAP
≈ 4.096V).
REF
FUNCTION
Multirange Inputs,
REF
= 4.096V ±1%.
Pin Description

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