LPC1112FHI33/202,5 NXP Semiconductors, LPC1112FHI33/202,5 Datasheet - Page 106
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
LPC1112FHI33/202,5
Manufacturer Part Number
LPC1112FHI33/202,5
Description
ARM Microcontrollers - MCU CortexM0 32bit 16KB up to 4 kB SRAM
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1112FHI33/202,5
Core
ARM Cortex M0
Processor Series
LPC1112
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
16 KB
Data Ram Size
4 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Factory Pack Quantity
490
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NXP Semiconductors
LPC111X
Product data sheet
Fig 63. Reflow soldering of the HVQFN33 package (7x7)
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 8 — 20 February 2013
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
© NXP B.V. 2013. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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