LPC1112FHN33/202 NXP Semiconductors, LPC1112FHN33/202 Datasheet - Page 4

• Manufacturer Part Number: LPC1112FHN33/202
• Description: ARM Microcontrollers - MCU CortexM0 32bit 16KB
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHN33/202

• Rohs: yes
• Core: ARM Cortex M0
• Data Bus Width: 32 bit

NXP Semiconductors
Table 1.
LPC111X
Product data sheet
Type number
LPC1112FHI33/203
LPC1112FHN33/103
LPC1112FHN33/203
LPC1113FHN33/201
LPC1113FHN33/202
LPC1113FHN33/203
LPC1113FHN33/301
LPC1113FHN33/302
LPC1113FHN33/303
LPC1114FHN33/201
LPC1114FHN33/202
LPC1114FHN33/301
LPC1114FHN33/302
LPC1114FHI33/302
LPC1114FHI33/303
LPC1114FHN33/203
LPC1114FHN33/303
LPC1114FHN33/333
LPC1113FBD48/301
LPC1113FBD48/302
LPC1113FBD48/303
LPC1114FBD48/301
LPC1114FBD48/302
Ordering information
Package
Name
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
…continued
Description
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 20 February 2013
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
© NXP B.V. 2013. All rights reserved.
Version
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SOT313-2
SOT313-2
SOT313-2
SOT313-2
SOT313-2
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