LPC1112FHN33/202 NXP Semiconductors, LPC1112FHN33/202 Datasheet - Page 94
LPC1112FHN33/202
Manufacturer Part Number
LPC1112FHN33/202
Description
ARM Microcontrollers - MCU CortexM0 32bit 16KB
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1112FHN33/202
Rohs
yes
Core
ARM Cortex M0
Data Bus Width
32 bit
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP
Quantity:
1 600
Company:
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP
Quantity:
5 000
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
Fig 51. Package outline SOT360-1 (TSSOP20)
LPC111X
Product data sheet
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT360-1
max.
1.1
A
0.15
0.05
A
20
1
1
Z
y
0.95
0.80
A
2
pin 1 index
IEC
0.25
A
3
e
D
0.30
0.19
b
p
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
D
6.6
6.4
Rev. 8 — 20 February 2013
0
(1)
11
10
w
E
4.5
4.3
M
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
2
E
LPC1110/11/12/13/14/15
A
1
5 mm
L
1
0.75
0.50
32-bit ARM Cortex-M0 microcontroller
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
X
θ
v
0.1
A
© NXP B.V. 2013. All rights reserved.
y
M
ISSUE DATE
A
99-12-27
03-02-19
Z
0.5
0.2
(1)
SOT360-1
8
0
θ
94 of 114
o
o