LPC1313FHN33/01,51 NXP Semiconductors, LPC1313FHN33/01,51 Datasheet - Page 3

• Manufacturer Part Number: LPC1313FHN33/01,51
• Description: ARM Microcontrollers - MCU CortexM3 32bit 32KB
• Manufacturer: NXP Semiconductors

Specifications of LPC1313FHN33/01,51

• Rohs: yes
• Core: ARM Cortex M3
• Processor Series: LPC1313
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 72 MHz
• Program Memory Size: 32 KB
• Data Ram Size: 8 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 2 V to 3.6 V
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 4000

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
Table 2.
LPC1311_13_42_43
Product data sheet
Type number
LPC1311FHN33
LPC1311FHN33/01
LPC1313FHN33
LPC1313FHN33/01
LPC1313FBD48
LPC1313FBD48/01
LPC1342FHN33
LPC1342FBD48
LPC1343FHN33
LPC1343FBD48
Type number
LPC1311FHN33
LPC1311FHN33/01
LPC1313FHN33
LPC1313FHN33/01
LPC1313FBD48
LPC1313FBD48/01
Ordering information
Ordering options for LPC1311/13/42/43
4.1 Ordering options
Package
Name
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
LQFP48
HVQFN33
LQFP48
HVQFN33
LQFP48






Flash
8 kB
8 kB
32 kB
32 kB
32 kB
32 kB
Unique device serial number for identification.
Available as 48-pin LQFP package and 33-pin HVQFN package.
eMetering
Lighting
Alarm systems
White goods
Total
SRAM
4 kB
4 kB
8 kB
8 kB
8 kB
8 kB
Description
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 ×
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 ×
1.4 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 ×
1.4 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 ×
1.4 mm
All information provided in this document is subject to legal disclaimers.
USB
-
-
-
-
-
-
Rev. 5 — 6 June 2012
Power
profiles
no
yes
no
yes
no
yes
UART
RS-485
1
1
1
1
1
1
I
Fast+
1
1
1
1
1
1
2
C/
32-bit ARM Cortex-M3 microcontroller
LPC1311/13/42/43
2
SSP ADC
1
1
1
1
1
channels
8
8
8
8
8
8
© NXP B.V. 2012. All rights reserved.
Pins
33
33
33
33
48
48
Package
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
LQFP48
Version
n/a
n/a
n/a
n/a
SOT313-2
SOT313-2
n/a
SOT313-2
n/a
SOT313-2
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