MPC8536BVTATLA Freescale Semiconductor, MPC8536BVTATLA Datasheet - Page 112

• Manufacturer Part Number: MPC8536BVTATLA
• Description: Microprocessors - MPU 8536 NON E
• Manufacturer: Freescale Semiconductor

Specifications of MPC8536BVTATLA

• Product Category: Microprocessors - MPU
• Rohs: yes
• Processor Series: PowerQUICC III
• Core: e500
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 250 MHz
• Program Memory Size: 32 KB
• Data Ram Size: 512 KB
• Interface Type: I2C, USB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: 0 C to + 105 C
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA-783

Electrical Characteristics
The recommended attachment method to the heat sink is illustrated in the following figure. The heat sink should be attached to
the printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force (45
Newton).
The system board designer can choose between several types of heat sinks to place on the chip. Ultimately, the final selection
of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass,
attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha
Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances, that will allow the chip to function in various environments.
2.24.3.1
For the packaging technology, shown in
This figure depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board.
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The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
Figure 73. Package Exploded Cross-Sectional View with Several Heat Sink Options
Internal Package Conduction Resistance
(Note the internal versus external package resistance)
External Resistance
External Resistance
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Internal Resistance
Figure 74. Package with Heat Sink Mounted to a Printed-Circuit Board
Thermal Interface Material
Printed-Circuit Board
Printed-Circuit Board
Table
Heat Sink
Heat Sink
Heat Sink
70, the intrinsic internal conduction thermal resistance paths are as follows:
Clip
Die
Radiation
Radiation
Convection
Convection
FC-PBGA Package
Thermal Interface Material
Die/Package
Die Junction
Package/Solder Spheres
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