PCAL6416AEVJ NXP Semiconductors, PCAL6416AEVJ Datasheet - Page 47

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PCAL6416AEVJ

Manufacturer Part Number
PCAL6416AEVJ
Description
Interface - I/O Expanders 16bit I2C/SMBus IO Expander w/Interrupt
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCAL6416AEVJ

Maximum Operating Frequency
100 kHz
Operating Supply Voltage
1.65 V to 5.5 V
Operating Temperature Range
- 40 C to + 85 C
Mounting Style
SMD/SMT
Package / Case
VFBGA-24
Operating Current
200 mA
Output Current
25 mA
Product Type
I/O Expanders

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PCAL6416AEVJ
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
PCAL6416A
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 38.
Table 39.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
< 2.5
 2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 38
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
39
Rev. 3 — 24 December 2012
41.
Low-voltage translating 16-bit I
Package reflow temperature (C)
Volume (mm
< 350
235
220
Package reflow temperature (C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
41) than a SnPb process, thus
 350
220
220
2
C-bus/SMBus I/O expander
PCAL6416A
245
> 2000
260
245
© NXP B.V. 2012. All rights reserved.
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