TDA8035HN/C1,151 NXP Semiconductors, TDA8035HN/C1,151 Datasheet - Page 24

• Manufacturer Part Number: TDA8035HN/C1,151
• Description: Interface - Specialized SMART CARD INTERFACE
• Manufacturer: NXP Semiconductors

Specifications of TDA8035HN/C1,151

• Rohs: yes
• Factory Pack Quantity: 490

NXP Semiconductors
Table 7.
V
[1]
[2]
[3]
[4]
TDA8035HN
Product data sheet
COMPANY PUBLIC
Symbol
I
I
Timing
t
t
t
t
Olim
sd
act
deact
act
deb
DDP
To meet these specifications, V
having a value of 220 nF.
The transition time and the duty factor definitions are shown in
PRESN and CMDVCCN are active LOW; RSTIN is active HIGH; for CLKDIV1 and CLKDIV2 see
Capacitance should not vary more than +- 30% compared to nominal value, taking all parameters into account (temperature, process
variation, biasing voltage, etc. Non exhaustive list)
= 3.3 V; V
Characteristics of IC
DD(INTF)
Parameter
output current limit
shutdown current
activation time
deactivation time
activation time
debounce time
= 3.3 V; f
Fig 12. Definition of output and input transition times
XTAL
CC
…continued
is decoupled to CGND using two ceramic multilayer capacitors of low ESR with both capacitors
= 10 MHz; GND = 0 V; T
All information provided in this document is subject to legal disclaimers.
Conditions
on pin I/O
on pin CLK
on pin RST
on pin V
on pin V
on pin V
on pin V
see
see
time of the window for sending
CLK to the card with XTAL1
on pin PRESN
t
page 13
t
page 13
act(start)
act(end
Rev. 2.1 — 3 December 2012
Figure 8 on page 13
Figure 9 on page 14
90%
t
r
CC
CC
CC
CC
) = t5; see
10%
= t3; see
= 5 V or 1.8 V
= 3 V
= 5 V or 1.8 V
= 3 V
t
Figure 12 on page
1
amb
10%
Figure 8 on
Figure 8 on
=25
90%
t
f

C; unless otherwise specified
t
2
24; d = t1/(t1+ t2)
Min
15
70
20
90
90
80
80
1847
35
1992
2055
2.96
Table
Typ
-
-
-
125
160
115
150
-
90
2690
2766
4.05
V
(V
V
TDA8035HN
4.
OH
OL
OH
+ V
Smart card interface
Max
+15
+70
+20
160
260
150
250
3390
250
3653
3749
5.55
fce666
OL
© NXP B.V. 2012. All rights reserved.
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Unit
mA
mA
mA
mA
mA
mA
mA
s
s
s
s
ms