IS42S32800B-7BL ISSI, Integrated Silicon Solution Inc, IS42S32800B-7BL Datasheet - Page 19
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IS42S32800B-7BL
Manufacturer Part Number
IS42S32800B-7BL
Description
IC SDRAM 256MBIT 143MHZ 90BGA
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Datasheet
1.IS42S32800B-7BL.pdf
(62 pages)
Specifications of IS42S32800B-7BL
Package / Case
90-BGA
Memory Size
256M (8Mx32)
Format - Memory
RAM
Memory Type
SDRAM
Speed
143MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Data Bus Width
32 bit
Organization
2 Mbit x 32
Maximum Clock Frequency
143 MHz
Access Time
7 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Maximum Operating Current
150 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Density
256Mb
Address Bus
14b
Access Time (max)
5.5ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
BGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
706-1024
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IS42S32800B
Integrated Silicon Solution, Inc.
Rev. F
07/21/09
Device Deselect command (CS#=”H”)
The Device Deselect command disables the command decoder so that the RAS#,CAS#,WE# and Address inputs
are ignored,regardless of whether the CLK is enabled.This command is similar to the No Operation command.
AutoRefresh command
(RAS#=”L”,CAS#=”L”,WE#=”H”,CKE =”H”)
The AutoRefresh command is used during normal operation of the SDRAM and is analogous to CAS#-before-
RAS#(CBR)Refresh in conventional DRAMs.This command is non-persistent,so it must be issued each time a
refresh is required.The addressing is generated by the internal refresh controller.This makes the address bits a
“don ’t care”during an AutoRefresh command.The internal refresh counter increments automatically on every
auto refresh cycle to all of the rows.The refresh operation must be performed 4096 times within 64ms (32ms for
Industrial grade). The time required to complete the auto refresh operation is specified by tRC(min.).To provide the
AutoRefresh command, all banks need to be in the idle state and the device must not be in power down mode (CKE is
precharge time requirement,tRP(min),must be met before successive auto refresh operations are performed.
SelfRefresh Entry command
(RAS#=”L”,CAS#=”L”,WE#=”H”,CKE =”L”)
The SelfRefresh is another refresh mode available in the SDRAM.It is the preferred refresh mode for data retention
and low power operation.Once the SelfRefresh command is registered,all the inputs to the SDRAM become “don
’t care”with the exception of CKE,which must remain LOW.The refresh addressing and timing is internally
generated to reduce power consumption.The SDRAM may remain in SelfRefresh mode for an indefinite period.
The SelfRefresh mode is exited by restarting the external clock and then asserting HIGH on CKE (SelfRefresh
Exit command).
SelfRefresh Exit command
(CKE =”H”,CS#=”H”or CKE =”H”,RAS#=”H”,CAS#=”H”,WE#=”H”)
Deselect commands must be issued for tRC(min.)because time is required for the completion of any bank
currently being internally refreshed.If auto refresh cycles in bursts are performed during normal operation,a burst
of 4096 auto refresh cycles should be completed just prior to entering and just after exiting the SelfRefresh mode.
Clock Suspend Mode Entry /PowerDown Mode Entry command (CKE =”L”)
When the SDRAM is operating the burst cycle,the internal CLK is suspended(masked)from the subsequent cycle
by issuing this command (asserting CKE “LOW”).The device operation is held intact while CLK is suspended.On
the other hand,when all banks are in the idle state,this command performs entry into the PowerDown mode.All
input and output buffers (except the CKE buffer)are turned off in the PowerDown mode.The device may not remain
in the Clock Suspend or PowerDown state longer than the refresh period (64ms)since the command does not
perform any refresh operations.
Clock Suspend Mode Exit /PowerDown Mode Exit command
When the internal CLK has been suspended,the operation of the internal CLK is einitiated from the subsequent
cycle by providing this command (asserting CKE “HIGH”).When the device is in the PowerDown mode,the device
exits this mode and all disabled buffers are turned on to the active state.t
exits from the PowerDown mode.Any subsequent commands can be issued after one clock cycle from the end
of this command.
Data Write /Output Enable,Data Mask /Output Disable command (DQM =”L”,”H”)
During a write cycle,the DQM signal functions as a Data Mask and can control every word of
the input data.During a read cycle,the DQM functions as the controller of output buffers.DQM is also used for
device selection,byte selection and bus control in a memory system.
high in the previous cycle).This command must be followed by NOPs until the auto refresh operation is completed.The
This command is used to exit from the SelfRefresh mode.Once this command is registered, NOP or Device
PDE
(min.)is required when the device
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