CY7C1354CV25-166AXC Cypress Semiconductor Corp, CY7C1354CV25-166AXC Datasheet - Page 29

• Manufacturer Part Number: CY7C1354CV25-166AXC
• Description: IC SRAM 9MBIT 166MHZ 100LQFP
• Manufacturer: Cypress Semiconductor Corp
• Type: Synchronousr

Specifications of CY7C1354CV25-166AXC

• Memory Size: 9M (256K x 36)
• Package / Case: 100-LQFP
• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: 0°C ~ 70°C
• Access Time: 3.5 ns
• Maximum Clock Frequency: 166 MHz
• Supply Voltage (max): 2.625 V
• Supply Voltage (min): 2.375 V
• Maximum Operating Current: 180 mA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Number Of Ports: 4
• Operating Supply Voltage: 2.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 428-2121; CY7C1354CV25-166AXC

Document History Page
Document Number: 38-05537 Rev. *K
Document Title: CY7C1354CV25/CY7C1356CV25 9-Mbit (256 K × 36/512 K × 18)
Pipelined SRAM with NoBL™ Architecture
Document Number: 38-05537
REV.
*C
*D
*G
*H
*A
*B
*E
*F
*K
*J
**
*I
ECN No.
2898958
3033272
3052726
242032
278969
284929
323636
332879
357258
377095
408298
501793
Issue Date
09/19/2010
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
03/25/10
10/08/10
Change
Orig. of
RXU
RKF
RKF
RKF
VKN
VBL
NJY
NJY
NJY
PCI
PCI
PCI
PCI
New data sheet
Changed Boundary Scan order to match the B Rev of these devices
Included DC Characteristics Table
Changed ISB1 and ISB3 from DC Characteristic table as follows:
ISB1: 225 MHz -> 130 mA, 200 MHz -> 120 mA, 167 MHz -> 110 mA
ISB3: 225 MHz -> 120 mA, 200 MHz -> 110 mA, 167 MHz -> 100 mA
Changed IDDZZ to 50mA.
Added BG and BZ pkg lead-free part numbers to ordering info section.
Changed frequency of 225 MHz into 250 MHz
Added t
Changed Θ
6.13 °C/W respectively
Changed Θ
14.0 °C/W respectively
Changed Θ
3.0 °C/W respectively
Modified address expansion as per JEDEC Standard
Removed comment of Lead-free BG and BZ packages availability
Unshaded 200 and 166 MHz speed bin in the AC/DC Table and Selection
Guide
Added Address Expansion pins in the Pin Definition Table
Removed description of Extest Output Bus Tri-state on page # 11
Modified V
Updated Ordering Information Table
Changed from Preliminary to Final
Changed I
Removed Shading on 250MHz Speed Bin in Selection Guide and AC/DC
Table
Updated Ordering Information Table
Modified test condition in note# 15 from V
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”
Changed three-state to tri-state.
Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in
the Electrical Characteristics Table.
Replaced Package Name column with Package Diagram in the Ordering
Information table.
Updated the Ordering Information Table.
Added the Maximum Rating for Supply Voltage on V
Changed t
AC Switching Characteristics table.
Updated the Ordering Information table.
Removed inactive parts from the ordering information table. Updated
package diagrams.
Added
Added
Minor edits and updated in new template
Removed pruned part CY7C1356CV25-200AXC from the
ordering information table.
Ordering Code Definitions
Acronyms
CYC
SB2
TH
OL
JA
JA
JA
of 4.0 ns for 250 MHz
, t
, V
and Θ
and Θ
and Θ
from 35 to 40 mA
TL
OH
from 25 ns to 20 ns and t
and
test conditions
JC
JC
JC
Units of Measure
for TQFP Package from 25 and 9 °C/W to 29.41 and
for BGA Package from 25 and 6 °C/W to 34.1 and
for FBGA Package from 27 and 6 °C/W to 16.8 and
Description of Change
DDQ
TDOV
< V
from 5 ns to 10 ns in TAP
DD
DDQ
to V
CY7C1354CV25
CY7C1356CV25
DDQ
Relative to GND
≤ V
DD
Page 29 of 30
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