UPMU-M3L1X-B-EK Silicon Labs, UPMU-M3L1X-B-EK Datasheet - Page 4

• Manufacturer Part Number: UPMU-M3L1X-B-EK
• Description: Daughter Cards & OEM Boards UDP SiM3L1xx MCU Card (no LCD)
• Manufacturer: Silicon Labs

Specifications of UPMU-M3L1X-B-EK

• Product: MCU Cards
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Description/function: MCU Card (No LCD) to use with UDP Motherboard
• Interface Type: I2C, SPI, UART
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Tool Is For Evaluation Of: SiM3L1xx
• For Use With: SiM3L1xx

SiM3L1xx
5. Ordering Information .........................................................................................................52
6. Pin Definitions.................................................................................................................... 54
7. Revision Specific Behavior............................................................................................... 92
Document Change List ........................................................................................................... 94
Contact Information ................................................................................................................ 95
4
4.8. Analog .......................................................................................................................... 49
4.9. Reset Sources..............................................................................................................50
4.10.Security ........................................................................................................................ 51
4.11.On-Chip Debugging ..................................................................................................... 51
6.1. SiM3L1x7 Pin Definitions ............................................................................................. 54
6.2. SiM3L1x6 Pin Definitions ............................................................................................. 62
6.3. SiM3L1x4 Pin Definitions ............................................................................................. 69
6.4. TQFP-80 Package Specifications ................................................................................ 74
6.5. TFBGA-80 Package Specifications .............................................................................. 78
6.6. QFN-64 Package Specifications .................................................................................. 82
6.7. TQFP-64 Package Specifications ................................................................................ 85
6.8. QFN-40 Package Specifications .................................................................................. 89
7.1. Revision Identification .................................................................................................. 92
4.7.2. UART (UART0).................................................................................................... 47
4.7.3. SPI (SPI0, SPI1) .................................................................................................. 48
4.7.4. I2C (I2C0) ............................................................................................................ 48
4.8.1. 12-Bit Analog-to-Digital Converter (SARADC0)................................................... 49
4.8.2. 10-Bit Digital-to-Analog Converter (IDAC0) ......................................................... 49
4.8.3. Low Current Comparators (CMP0, CMP1) .......................................................... 49
6.4.1. TQFP-80 Solder Mask Design............................................................................. 77
6.4.2. TQFP-80 Stencil Design ...................................................................................... 77
6.4.3. TQFP-80 Card Assembly..................................................................................... 77
6.5.1. TFBGA-80 Solder Mask Design .......................................................................... 81
6.5.2. TFBGA-80 Stencil Design.................................................................................... 81
6.5.3. TFBGA-80 Card Assembly .................................................................................. 81
6.6.1. QFN-64 Solder Mask Design............................................................................... 84
6.6.2. QFN-64 Stencil Design ........................................................................................ 84
6.6.3. QFN-64 Card Assembly....................................................................................... 84
6.7.1. TQFP-64 Solder Mask Design............................................................................. 88
6.7.2. TQFP-64 Stencil Design ...................................................................................... 88
6.7.3. TQFP-64 Card Assembly..................................................................................... 88
6.8.1. QFN-40 Solder Mask Design............................................................................... 91
6.8.2. QFN-40 Stencil Design ........................................................................................ 91
6.8.3. QFN-40 Card Assembly....................................................................................... 91
Rev 0.5