UPMU-M3L1X-B-EK Silicon Labs, UPMU-M3L1X-B-EK Datasheet - Page 81
UPMU-M3L1X-B-EK
Manufacturer Part Number
UPMU-M3L1X-B-EK
Description
Daughter Cards & OEM Boards UDP SiM3L1xx MCU Card (no LCD)
Manufacturer
Silicon Labs
Datasheet
1.UPMU-M3L1X-B-EK.pdf
(95 pages)
Specifications of UPMU-M3L1X-B-EK
Product
MCU Cards
Core
ARM Cortex M3
Data Bus Width
32 bit
Description/function
MCU Card (No LCD) to use with UDP Motherboard
Interface Type
I2C, SPI, UART
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Tool Is For Evaluation Of
SiM3L1xx
For Use With
SiM3L1xx
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6.5.1. TFBGA-80 Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad
is to be 60 µm minimum, all the way around the pad.
6.5.2. TFBGA-80 Stencil Design
6.5.3. TFBGA-80 Card Assembly
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
good solder paste release.
Components.
Rev 0.5
SiM3L1xx
81
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