BUK9640-100A /T3 NXP Semiconductors, BUK9640-100A /T3 Datasheet - Page 4

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BUK9640-100A /T3

Manufacturer Part Number
BUK9640-100A /T3
Description
MOSFET TAPE13 PWR-MOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK9640-100A /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
39 A
Resistance Drain-source Rds (on)
0.039 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
90 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
158 W
Rise Time
135 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
125 ns
Part # Aliases
BUK9640-100A,118
NXP Semiconductors
5. Thermal characteristics
Table 5.
BUK9640-100A
Product data sheet
Symbol
R
R
Fig 3.
Fig 4.
th(j-mb)
th(j-a)
Z
(K/W)
th(j-mb)
(A)
I
10
10
10
D
10
10
10
1
1
−1
−2
−3
3
2
10
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
Transient thermal impedance from junction to mounting base as a function of pulse duration
1
−6
Thermal characteristics
0.2
0.1
0.05
δ = 0.5
0.02
Single Shot
Parameter
thermal resistance
from junction to
mounting base
thermal resistance
from junction to
ambient
R
DSon
10
−5
= V
DS
/ I
D
Conditions
see
All information provided in this document is subject to legal disclaimers.
mounted on a printed-circuit board ;
minimum footprint
10
10
DC
−4
Figure 4
Rev. 04 — 31 May 2010
10
−3
10
10
N-channel TrenchMOS logic level FET
−2
2
100 ms
1 ms
10 ms
t
100 μs
p
= 10 μs
BUK9640-100A
Min
-
-
10
P
V
−1
DS
Typ
-
50
t
(V)
p
T
© NXP B.V. 2010. All rights reserved.
t
p
(s)
δ =
Max
0.95
-
03nh72
03nh73
T
t
t
p
10
1
3
Unit
K/W
K/W
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