SI6467BDQ-T1 Vishay/Siliconix, SI6467BDQ-T1 Datasheet - Page 7
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SI6467BDQ-T1
Manufacturer Part Number
SI6467BDQ-T1
Description
MOSFET 12V 8.0A 1.05W
Manufacturer
Vishay/Siliconix
Datasheet
1.SI6467BDQ-T1.pdf
(11 pages)
Specifications of SI6467BDQ-T1
Product Category
MOSFET
Transistor Polarity
P-Channel
Drain-source Breakdown Voltage
12 V
Gate-source Breakdown Voltage
+/- 8 V
Continuous Drain Current
6.8 A
Resistance Drain-source Rds (on)
12.5 mOhms
Configuration
Single
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
TSSOP-8
Fall Time
85 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
1.05 W
Rise Time
85 ns
Factory Pack Quantity
3000
Tradename
TrenchFET
Typical Turn-off Delay Time
220 ns
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI6467BDQ-T1-E3
Manufacturer:
VISHAY
Quantity:
12 830
Part Number:
SI6467BDQ-T1-E3
Manufacturer:
VISHAY/威世
Quantity:
20 000
Company:
Part Number:
SI6467BDQ-T1-GE3
Manufacturer:
TI
Quantity:
126
Wharton McDaniel and David Oldham
When
MOSFETs, it was the first time that power MOSFETs had been
offered in a true surface-mount package, the SOIC. LITTLE
FOOT immediately found a home in new small form factor disk
drives, computers, and cellular phones.
The new LITTLE FOOT TSSOP-8 power MOSFETs are the
natural evolutionary response to the continuing demands of
many markets for smaller and smaller packages. LITTLE
FOOT TSSOP-8 MOSFETs have a smaller footprint and a
lower profile than LITTLE FOOT SOICs, while maintaining low
r
accomplished this by putting one or two high-density MOSFET
die in a standard 8-pin TSSOP package mounted on a custom
leadframe.
THE TSSOP-8 PACKAGE
LITTLE
approximately half the PC board area of an equivalent LITTLE
FOOT device (Figure 1). In addition to the reduction in board
area, the package height has been reduced to 1.1 mm.
Document Number: 70571
12-Dec-03
Figure 1.
DS(on)
and high thermal performance. Vishay Siliconix has
Vishay Siliconix introduced its LITTLE FOOT
Side View
Top View
FOOT
An TSSOP-8 Package Next to a SOIC-8 Package
with Views from Both Top and Side
The Next Step in Surface-Mount Power MOSFETs
TSSOP-8
power
LITTLE FOOTR TSSOP-8
MOSFETs
require
This is the low profile demanded by applications such as
PCMCIA cards.
It reduces the power package to the same height as many
resistors and capacitors in 0805 and 0605 sizes. It also allows
placement on the “passive” side of the PC board.
The standard pinouts of the LITTLE FOOT TSSOP-8
packages have been changed from the standard established
by LITTLE FOOT. This change minimizes the contribution of
interconnection resistance to r
transfer of heat out of the package.
Figure 2 shows the pinouts for a single-die TSSOP. Notice that
both sides of the package have Source and Drain
connections, whereas LITTLE FOOT has the Source and Gate
connections on one side of the package, and the Drain
connections are on the opposite side.
Figure 3 shows the standard pinouts for a dual-die TSSOP-8.
In this case, the connections for each individual MOSFET
occupy one side.
Source 1
Source 1
Drain 1
Source
Source
Gate 1
Drain
Gate
Figure 2.
Figure 3.
Pinouts for Single Die TSSOP
Pinouts for Dual-Die TSSOP
DS(on)
Vishay Siliconix
and maximizes the
AN1001
www.vishay.com
Drain
Source
Source
Drain
Drain 2
Source 2
Source 2
Gate 2
1