IS61C1024AL-12TI ISSI, Integrated Silicon Solution Inc, IS61C1024AL-12TI Datasheet - Page 15

• Manufacturer Part Number: IS61C1024AL-12TI
• Description: IC SRAM 1MBIT 12NS 32TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc

Specifications of IS61C1024AL-12TI

• Format - Memory: RAM
• Memory Type: SRAM - Asynchronous
• Memory Size: 1M (128K x 8)
• Speed: 12ns
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-TSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

PACKAGING INFORMATION
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
300-mil Plastic SOJ
Package Code: J
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. D
02/25/03
Sym.
N0.
Leads
A
A1
A2
b
B
C
D
E
E1
E2
e
N
1
e
17.02
Min. Typ. Max.
2.41
0.41
0.66
0.20
8.26
7.49
6.27
0.64
MILLIMETERS
—
1.27 BSC
24/26
—
—
—
—
—
—
—
—
—
—
D
17.27
3.56
2.67
0.51
0.81
0.25
8.76
7.75
7.29
—
b
B
0.025
0.095
0.016
0.026
0.008
0.670
0.325
0.247
Min. Typ. Max.
0.295
—
0.050 BSC
INCHES
A
E1
—
—
—
—
—
—
—
—
A1
— 0.140
—
0.105
0.020
0.032
0.010
0.680
0.345
0.305
0.287
1-800-379-4774
—
E
SEATING PLANE
Notes:
1. Controlling dimension: inches, unless otherwise
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash
4. Formed leads shall be planar with respect to one
specified.
protrusions and
the package
another within 0.004 inches at the seating plane.
E2
.
should be measured from the bottom of
A2
ISSI
C
®