IS61C1024AL-12TI ISSI, Integrated Silicon Solution Inc, IS61C1024AL-12TI Datasheet - Page 17

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IS61C1024AL-12TI

Manufacturer Part Number
IS61C1024AL-12TI
Description
IC SRAM 1MBIT 12NS 32TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Datasheet

Specifications of IS61C1024AL-12TI

Format - Memory
RAM
Memory Type
SRAM - Asynchronous
Memory Size
1M (128K x 8)
Speed
12ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
32-TSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
PACKAGING INFORMATION
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. C
06/13/03
Plastic TSOP-Type I
Package Code: T (32-pin)
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
S
No. Leads
Symbol
A1
A
B
C
D
E
H
S
e
L
18.30
19.80
MILLIMETERS
Min.
0.05
0.17
0.12
7.90
0.40
0.50 BSC
0.25 REF
e
D
18.50
20.20
Max.
1.20
0.25
0.23
0.17
8.10
0.60
32
0.002
0.007
0.005
0.311
0.720
0.780
0.016
Min.
B
0.020 BSC
0.010 REF
N
1
INCHES
A
E
0.047
0.010
0.009
0.007
0.319
0.728
0.795
0.024
Max.
A1
1-800-379-4774
H
SEATING PLANE
Notes:
1. Controlling dimension: millimeters, unless
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
4. Formed leads shall be planar with respect
L
otherwise specified.
flash protrusions and should be measured
from the bottom of the package.
to one another within 0.004 inches at the
seating plane.
α
ISSI
C
®

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