ADL5375-05-EVALZ Analog Devices, ADL5375-05-EVALZ Datasheet - Page 32

• Manufacturer Part Number: ADL5375-05-EVALZ
• Description: RF Development Tools ADL5375-05 EVAL
• Manufacturer: Analog Devices
• Type: Modulators / Demodulatorsr
• Series: ADL5375r

Specifications of ADL5375-05-EVALZ

• Rohs: yes
• Product: Evaluation Boards
• Factory Pack Quantity: 1

Data Sheet
Figure 77. Evaluation Board Layout, Bottom Layer
Figure 76. Evaluation Board Layout, Top Layer
Rev. B | Page 32 of 36
Thermal Grounding and Evaluation Board Layout
The package for the
the underside that should be well soldered to a low thermal
and electrical impedance ground plane. This paddle is typically
soldered to an exposed opening in the solder mask on the
evaluation board. Figure 78 illustrates the dimensions used in
the layout of the
Board (1 mil. = 0.0254 mm).
Notice the use of nine via holes on the exposed paddle. These
ground vias should be connected to all other ground layers on
the evaluation board to maximize heat dissipation from the
device package.
Under these conditions, the thermal impedance of the
was measured to be approximately 30°C/W in still air.
Figure 78. Dimensions for Evaluation Board Layout for the
ADL5375
ADL5375
19.7 mil.
25 mil.
133.8 mil.
12 mil.
98.4 mil.
footprint on the
features an exposed paddle on
23 mil.
ADL5375
12 mil.
82 mil.
ADL5375
ADL5375
Evaluation
ADL5375
Package