MT48LC8M16LFB4-8 IT:G Micron Technology Inc, MT48LC8M16LFB4-8 IT:G Datasheet - Page 37

• Manufacturer Part Number: MT48LC8M16LFB4-8 IT:G
• Description: IC SDRAM 128MBIT 125MHZ 54VFBGA
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48LC8M16LFB4-8 IT:G

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 128M (8Mx16)
• Speed: 125MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 54-VFBGA
• Organization: 8Mx16
• Density: 128Mb
• Address Bus: 14b
• Access Time (max): 19/8/7ns
• Maximum Clock Rate: 125MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 100mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 23:
Figure 24:
PDF: 09005aef807f4885/Source: 09005aef8071a76b
128Mbx16x32Mobile_2.fm - Rev. M 1/09 EN
Random WRITE Cycles
WRITE-to-READ
Notes:
Notes:
In the case of a fixed-length burst being executed to completion, a PRECHARGE
command issued at the optimum time (as described above) provides the same operation
that would result from the same fixed-length burst with auto precharge. The disadvan-
tage of the PRECHARGE command is that it requires that the command and address
buses be available at the appropriate time to issue the command; the advantage of the
PRECHARGE command is that it can be used to truncate fixed-length or full-page bursts.
COMMAND
1. Each WRITE command may be to any bank.
2. DQM is LOW.
3. Example shows BL = 1 or an interrupting BL > 1.
COMMAND
1. The WRITE command may be to any bank, and the READ command may be to any bank.
2. DQM is LOW.
3. CL = 2 for illustration.
4. Data n + 1 is either the last data of BL = 1 or the last desired of a longer burst.
ADDRESS
ADDRESS
CLK
DQ
CLK
DQ
WRITE
BANK,
TRANSITIONING DATA
COL n
D
T0
BANK,
WRITE
COL n
n
IN
D
T0
n
IN
n + 1
NOP
T1
D
WRITE
BANK,
COL a
IN
T1
D
a
IN
TRANSITIONING DATA
BANK,
READ
COL b
T2
WRITE
BANK,
COL x
D
T2
37
x
IN
DON’T CARE
T3
NOP
WRITE
BANK,
COL m
T3
D
m
IN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
NOP
D
T4
OUT
b
128Mb: x16, x32 Mobile SDRAM
DON’T CARE
NOP
T5
b + 1
D
OUT
©2001 Micron Technology, Inc. All rights reserved.
READs