MT48V8M16LFB4-8 IT:G Micron Technology Inc, MT48V8M16LFB4-8 IT:G Datasheet - Page 79
![IC SDRAM 128MBIT 125MHZ 54VFBGA](/photos/7/22/72286/557-54-fbga_sml.jpg)
MT48V8M16LFB4-8 IT:G
Manufacturer Part Number
MT48V8M16LFB4-8 IT:G
Description
IC SDRAM 128MBIT 125MHZ 54VFBGA
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Specifications of MT48V8M16LFB4-8 IT:G
Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
128M (8Mx16)
Speed
125MHz
Interface
Parallel
Voltage - Supply
2.3 V ~ 2.7 V
Operating Temperature
-40°C ~ 85°C
Package / Case
54-VFBGA
Organization
8Mx16
Density
128Mb
Address Bus
14b
Access Time (max)
19/8/7ns
Maximum Clock Rate
125MHz
Operating Supply Voltage (typ)
2.5V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Supply Current
100mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Figure 58:
PDF: 09005aef807f4885/Source: 09005aef8071a76b
128Mbx16x32Mobile_2.fm - Rev. M 1/09 EN
SEATING PLANE
DIMENSIONS APPLY
TO SOLDER BALLS POST
REFLOW. THE PRE-
REFLOW DIAMETER IS
0.42 ON A 0.40 SMD
BALL PAD
11.20 ±0.10
90X Ø0.45
0.10 A
90-Ball FBGA, “F5/B5” Package (x32 Device), 8mm x 13mm
BALL A9
5.60 ±0.05
Notes:
A
0.65 ±0.05
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.4mm ±0.025mm.
3. Package width and length do not include mold protrusion; allowable mold protrusion is
4. Topside part marking decoder can be found at
0.25mm per side.
3.20
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
79
13.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
128Mb: x16, x32 Mobile SDRAM
www.micron.com/decoder.
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
BALL A1 ID