MT47H64M8CB-5E:B Micron Technology Inc, MT47H64M8CB-5E:B Datasheet - Page 132

IC DDR2 SDRAM 512MBIT 5NS 60FBGA

MT47H64M8CB-5E:B

Manufacturer Part Number
MT47H64M8CB-5E:B
Description
IC DDR2 SDRAM 512MBIT 5NS 60FBGA
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT47H64M8CB-5E:B

Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
512M (64M x 8)
Speed
5ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
60-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT47H64M8CB-5E:B
Manufacturer:
MICRON
Quantity:
12 388
Part Number:
MT47H64M8CB-5E:B
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT47H64M8CB-5E:B TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Figure 90:
PDF: 09005aef8117c18e, Source: 09005aef8211b2e6
512MbDDR2_2.fm - Rev. K 8/06 EN
SEATING
PLANE
8.00
0.10 C
SOLDER BALL
DIAMETER REFERS
TO POST-REFLOW
CONDITION.
BALL A9
60X Ø0.45
4.00
C
60-Ball FBGA Package – 12mm x 10mm (x4, x8)
Note:
3.20
12.00 ±0.10
1.80 ±0.05
6.40
CTR
C L
All dimensions are in millimeters.
0.80
TYP
6.00 ±0.05
C L
BALL A1
5.00 ±0.05
0.80 TYP
BALL A1 ID
0.80 ±0.05
132
10.00 ±0.10
0.155 ±0.013
1.20 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
SOLDER BALL MATERIAL:
SOLDER BALL PAD:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVALAC
96.5% Sn, 3% Ag, 0.5% Cu
Ø0.33 NON SOLDER MASK DEFINED
BALL A1 ID
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved.

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