MT48V8M16LFB4-10:G Micron Technology Inc, MT48V8M16LFB4-10:G Datasheet - Page 56
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MT48V8M16LFB4-10:G
Manufacturer Part Number
MT48V8M16LFB4-10:G
Description
IC SDRAM 128MBIT 100MHZ 54VFBGA
Manufacturer
Micron Technology Inc
Datasheet
1.MT48LC8M16LFB4-75MG_TR.pdf
(80 pages)
Specifications of MT48V8M16LFB4-10:G
Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
128M (8Mx16)
Speed
100MHz
Interface
Parallel
Voltage - Supply
2.3 V ~ 2.7 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-VFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT48V8M16LFB4-10:G
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Company:
Part Number:
MT48V8M16LFB4-10:G TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Table 21:
Table 22:
Table 23:
Table 24:
PDF: 09005aef807f4885/Source: 09005aef8071a76b
128Mbx16x32Mobile_2.fm - Rev. M 1/09 EN
Parameter/Condition
Operating current: Active mode; Burst = 2;
READ or WRITE;
Standby current: Power-down mode; All banks idle; CKE = LOW
Standby current: Active mode; CKE = HIGH; CS# = HIGH; All
banks active after
Operating current: Burst mode; Page
burst; READ or WRITE; All banks active
Auto refresh current: CKE = HIGH;
CS# = HIGH
Temperature-Compensated Self Refresh (TCSR)
Parameter/Condition
Parameter
Parameter
Self refresh current: CKE < 0.2V (E4 = 1, E3 = 1)
Self refresh current: CKE < 0.2V (E4 = 0, E3 = 0)
Self refresh current: CKE < 0.2V (E4 = 0, E3 = 1)
Self refresh current: CKE < 0.2V (E4 = 1, E3 = 0)
Input capacitance: CLK
Input capacitance: All other input-only pins
Input/Output capacitance: DQ
Input capacitance: CLK
Input capacitance: All other input-only pins
Input/Output capacitance: DQ
I
Notes 1, 3, 6, 11, 13, 31 apply to entire table; notes appear on page 57; V
V
I
Note 4 applies to entire table; notes appear on page 57; V
±0.2V or V
Capacitance (FBGA Pacakge)
Note 2 applies to entire table; notes appear on page 57
Capacitance (TSOP Pacakge)
Note 2 applies to entire table; notes appear on page 57
DD
DD
DD
t
RC =
7 Self Refresh Current Options (x32)
Q = 2.5V ±0.2V or V
Specifications And Conditions (x32)
t
RCD met; No accesses in progress
t
RC (MIN)
DD
= +2.5V ±0.2V, V
DD
= +2.5V ±0.2V, V
t
t
t
DD
RFC =
RFC = 15.625µs
RFC = 3.906µs(AT)
Q = +1.8V ±0.15V
t
RFC (MIN)
DD
Q = +1.8V ±0.15V
56
Symbol
Symbol
Symbol
I
I
I
I
I
I
I
DD1
DD2
DD3
DD4
DD5
DD6
DD6
C
C
C
C
C
C
Micron Technology, Inc., reserves the right to change products or specifications without notice.
IO
IO
I1
I2
I1
I2
DD
= V
-75M
150
450
130
235
128Mb: x16, x32 Mobile SDRAM
45
DD
Temperature
3
6
Min
Min
Q = +3.3V ±0.3V or V
1.5
1.5
3.0
2.5
2.5
4.0
Max
85ºC
70ºC
45ºC
15ºC
Max
DD
150
450
115
220
45
-8
3
6
Electrical Specifications
= V
Max
Max
3.5
3.8
6.0
3.5
3.8
6.0
DD
©2001 Micron Technology, Inc. All rights reserved.
Q = +3.3V ±0.3V or V
-75M/-8/-10
120
450
110
180
-10
40
3
6
1000
550
400
350
DD
Units
Units
pF
pF
pF
pF
pF
pF
= V
Units
mA
mA
mA
mA
mA
mA
µA
DD
Q = 2.5V
Notes
Notes
Units
12, 18,
19, 32,
Notes
18, 19
12, 33
18, 19
µA
µA
µA
µA
28
29
30
28
29
30
DD
19
33
=