SDED5-004G-NCT SanDisk, SDED5-004G-NCT Datasheet - Page 52

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SDED5-004G-NCT

Manufacturer Part Number
SDED5-004G-NCT
Description
IC MDOC H3 4GB FBGA
Manufacturer
SanDisk
Datasheet

Specifications of SDED5-004G-NCT

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
32G (4G x 8)
Interface
Parallel
Voltage - Supply
1.65 V ~ 1.95 V
Operating Temperature
-25°C ~ 85°C
Package / Case
115-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
SDED5-004G-NCT
Manufacturer:
SanDisk
Quantity:
10 000
Rev. 1.3
52
7. The series inductance of the capacitors marked as required should be less than 15nH.
8. For this configuration, we recommend that the 0.1uF capacitor will be located close
9. For compatibility with next generation mDOC H3 devices we recommend adding an
10. In this configuration the internal charge pump is disabled. Installing a 33nF or 47nF
11. In this configuration the voltage regulator is disabled and no capacitors are required
12. In this configuration the internal charge pump is enabled. The current mDOC H3
13. This capacitor is critical for the operation of the internal charge pump. For the current
14. For the current mDOC H3 device a 0.1uF capacitor is required but it can also be
15. In case there are multiple balls available for a power supply then the recommended
16. For systems that use a cascaded configuration, each mDOC H3 device must have its
17. The capacitors must be placed as close as possible to the package leads. Below are
18. BUSY#, DMARQ# and IRQ# should not be pulled up to any voltage higher than
to the VCC ball and the 10nF capacitor will be located close to the VCC2 ball. If this
placement is not possible then both capacitors should be located as close as possible
to the VCC ball. The 10nF capacitor is only recommended in order to reduce high
frequency noise.
additional 0.1uF capacitor in parallel with the required 1uF capacitor. For designs that
will only use the current mDOC H3 device only the 1uF capacitor is required.
capacitor will have no impact on the device.
on this ball. Installing a capacitor on this ball will have no impact on the device.
device requires at least a 1uF capacitor on VCC2 but it can also be operated with
1.5uF capacitor. However, for SDED5-AAAB-CCC devices, a 1.5uF will be required.
The 0.1uF capacitor is only recommended in order to reduce high frequency noise.
mDOC H3 device a 33nF capacitor is required but it can also be operated with a 47nF
capacitor. However, for for SDED5-AAAB-CCC devices, a 47nF capacitor will be
required.
operated with a 0.33uF capacitor. However, f for SDED5-AAAB-CCC devices, a
0.33uF capacitor will be required. This applies only to 1.8V Core and I/O
configuration.
capacitors do not need to be duplicated for all balls but can be placed near one or
more balls.
own set of required capacitors. Required capacitors cannot be shared between
devices. Capacitors that are recommended can be shared between devices, however
their effectiveness may be reduced. Careful analysis of the potential noise on the
power supply pins should be conducted before deciding to share capacitors and
reduce the total number of recommended capacitors.
some drawings that depict the various power connectivity options. All options are
valid for both MUX and DEMUX configurations.
VCCQ.
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
Design Considerations
92-DS-1205-10

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