MX884HTTR IXYS, MX884HTTR Datasheet - Page 165
![no-image](/images/manufacturer_photos/0/3/352/ixys_sml.jpg)
MX884HTTR
Manufacturer Part Number
MX884HTTR
Description
IC CURRENT MONITOR TSOT23-6
Manufacturer
IXYS
Specifications of MX884HTTR
Function
Current Monitor
Sensing Method
High-Side
Voltage - Input
3 ~ 60 V
Mounting Type
Surface Mount
Package / Case
TSOT-23-6, TSOT-6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output
-
Operating Temperature
-
Accuracy
-
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1~ Rectifier Bridges
1~ Rectifier Bridges with Avalanche Diodes, B2U
1~ Rectifier Bridges with Standard Diodes, B2U
Data according to IEC 60747 and refer to a single diode or thyristor unless otherwise stated.
¡
¡ VBO 19-08NO7
¡ VBO 19-12NO7
¡ VBO 45-08NO7
¡ VBO 45-12NO7
¡ VBO 45-14NO7
¡ VBO 45-16NO7
¡ VBO 45-18NO7
Type
Not for new designs
New
VBO 13-12AO2
VBO 13-14AO2
VBO 13-16AO2
VBO 20-12AO2
VBO 20-14AO2
VBO 20-16AO2
VBO 25-12AO2
VBO 25-14AO2
VBO 25-16AO2
VBO 13-08NO2
VBO 13-12NO2
VBO 13-14NO2
VBO 13-16NO2
FBO 16-12N
VBO 20-08NO2
VBO 20-12NO2
VBO 20-14NO2
VBO 20-16NO2
VBO 21-08NO7
VBO 21-12NO7
VBO 22-08NO8
VBO 22-12NO8
VBO 22-14NO8
VBO 22-16NO8
VBO 22-18NO8
GBO 25-12NO1
GBO 25-16NO1
VBO 25-08NO2
VBO 25-12NO2
VBO 25-14NO2
VBO 25-16NO2
VBO 30-08NO7
VBO 30-12NO7
VBO 30-14NO7
VBO 30-16NO7
VBO 30-18NO7
VBO 36-08NO8
VBO 36-12NO8
VBO 36-14NO8
VBO 36-16NO8
VBO 36-18NO8
FBO 40-12N
VBO 40-08NO6
VBO 40-12NO6
VBO 40-16NO6
1200
1400
1600
1200
1400
1600
1200
1400
1600
1200
1200
1600
1200
1200
1200
1400
1600
1200
1200
1400
1600
1800
1200
1600
1200
1400
1600
1200
1400
1600
1800
1200
1400
1600
1800
1200
1200
1600
1200
1400
1600
1800
V
800
800
800
800
800
800
800
800
800
800
RRM
V
V
400
500
500
400
440
500
400
440
500
250
400
400
500
400
250
400
250
400
440
500
250
400
250
400
440
500
575
400
500
250
400
440
500
250
400
440
500
575
250
400
440
500
575
400
250
400
500
250
400
440
500
575
vRMS
V
I
18
31
38
18
22
21
31
21
17
25
38
35
23
40
40
45
dAV
A
@
100
100
100
100
°C
85
85
85
85
90
85
85
80
85
85
85
90
T
C
10 ms
45°C
220
300
370
220
100
100
300
100
380
370
370
400
550
250
300
550
I
FSM
A
0.85
0.85
0.85
0.85
0.83
0.80
0.85
0.80
0.85
0.89
0.85
0.85
0.80
0.83
0.80
0.80
V
V
T0
17.0
14.0
17.0
28.0
40.0
14.0
40.0
12.0
12.2
12.0
10.0
13.0
mW
r
8.0
8.0
5.8
8.0
T
T
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
°C
VJM
Chip
R
K/W
5.60
3.00
2.80
5.60
4.00
2.30
3.00
2.30
8.20
4.30
2.80
2.80
6.20
2.30
1.70
1.45
per
thJC
R
Chip
K/W
6.00
3.40
3.20
6.00
5.00
2.80
3.40
2.80
9.40
4.80
3.20
3.40
7.40
2.90
2.00
1.90
per
thJH
Chip
P
per
kW
2.5
3.4
3.4
RSM
-
-
-
-
-
-
-
-
-
-
-
-
X024a
X116b
X025a
X119b
X116b
X024a
X027a
X118h
X115
X115
X100
X115
X101
X115
Fig.
No.
X027a
Weight = 30 g miniBLOC
X024a
Weight = 6 g
X025a
Weight = 7 g
X100
Weight = 17 g
X101
Weight =
19 g
See data sheet for pin arrangement
X115
Weight
= 15 g
X116b
Weight
= 22 g
X118h
Weight = 100 g
X119b
Weight = 135 g
See data sheet for pin arrangement
on pages O-30...O-52
Outline drawings
Package style
ISOPLUS i4-PAC
ECO-PAC 1
SOT-227B
Slim-Pack
PWS-A
FO-T-A
GBFP
FO-A
FO-B
143
TM
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