MX884HTTR IXYS, MX884HTTR Datasheet - Page 58
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MX884HTTR
Manufacturer Part Number
MX884HTTR
Description
IC CURRENT MONITOR TSOT23-6
Manufacturer
IXYS
Specifications of MX884HTTR
Function
Current Monitor
Sensing Method
High-Side
Voltage - Input
3 ~ 60 V
Mounting Type
Surface Mount
Package / Case
TSOT-23-6, TSOT-6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output
-
Operating Temperature
-
Accuracy
-
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MX860
±15V ePaper Source Driver
Features
• CMOS Technology
• ±15 Volt Output Driver Supply Voltage
• Drives Segment or Active Matrix Displays
• 4 Level Gray Scale
• 25MHz Clock Frequency
• Bi-Directional Data Transfer
• Selectable Register Length
• 2.7V to 5.5V Logic Supply Voltage
• Cascadable
Applications
• eBooks / eReaders
• Electronic Shelf Labels / Point Of Purchase Displays
• Mobile Phones / Portable Hand Held Devices
• Smart Cards
• Signage
Block Diagram
36
VPOS
VSS
VNEG
OE
LE
D(7..0)
SHR
MODE1
MODE0
CE
CL
Data path when
SHR = 1
OUT1
4-way Interleaved
2-bit Register
Stages
OUT2
LEVEL SHIFTER / DRIVER
CONTROL LOGIC
4x(1 - 60)
. . .
DECODE
LATCH
when
mode 240
SHR = 0
61 - 64
OUT267 OUT268
256
65 - 67
268
Clock
Direction
General Description
The MX860 is a selectable 240, 256, or 268 bit long 2-bit wide
serial-input parallel-output digital shift register with level
conversion on each parallel output which converts the 2 digital
bits into VPOS, VSS, or VNEG analog output voltages. An 8-bit
input bus simultaneously inputs 4 groups of 2 bits each.
The MX860 consists of a selectable length Bi-Directional Input
Register, Transfer Latch, and 268 bit Level Shifter / Output
Driver. Each „OUT“ pin is switched to one of [VSS, VPOS, VNEG]
according to the D0...D7 logic levels clocked into the MX860,
modified by the OE pin.
The MX860 is designed to operate over a temperature range of
-40°C to +85°C, and is available as Gold Bumped in Wafer Form
or Waffle Pack, and 48mm Tape Carrier Package.
Ordering Information
Part No.
MX860WB
MX860XB
MX860TC
Description
Gold Bumped Die / Wafer Form
Gold Bumped Die / Waffle Pack
48mm Super Wide Tape Carrier
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