NCP5304DR2G ON Semiconductor, NCP5304DR2G Datasheet - Page 11

• Manufacturer Part Number: NCP5304DR2G
• Description: IC DRIVER HI/LOW SIDE HV 8-SOIC
• Manufacturer: ON Semiconductor
• Type: High Side/Low Sider

Specifications of NCP5304DR2G

• Configuration: Half Bridge
• Input Type: Non-Inverting
• Delay Time: 100ns
• Current - Peak: 250mA
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 600V
• Voltage - Supply: 10 V ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Rise Time: 160 ns
• Fall Time: 75 ns
• Supply Voltage (min): 10 V
• Supply Current: 5 mA
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Bridge Type: Full Bridge, Half Bridge
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

0.16
0.12
0.08
0.04
400
350
300
250
200
150
100
600
500
400
300
200
100
0.2
50
0
0
0
10
10
0
Figure 32. Output Source Current vs. Supply
Figure 36. Leakage Current on High Voltage
Pins (600 V) to Ground vs. V
Figure 34. Output Sink Current vs. Supply
100
I
src
12
12
(V
I
src
High Side
BRIGDE
High Side
Voltage (V
Voltage (V
HV PINS VOLTAGE (V)
200
I
V
I
src
src
V
CC
CC
14
14
= V
Low Side
, VOLTAGE (V)
Low Side
, VOLTAGE (V)
BOOT
300
CC
CC
= V
= V
= VDRV_HI)
16
16
BOOT
BOOT
BRIDGE
400
)
)
18
18
Voltage
500
http://onsemi.com
600
20
20
11
600
500
400
300
200
100
400
350
300
250
200
150
100
20
15
10
50
0
5
0
−40
0
−40
−40
Figure 37. Leakage Current on High Voltage
I
src
−20
Pins (600 V) to Ground vs. Temperature
(VBRIDGE = V
−20
−20
Figure 33. Output Source Current vs.
Low Side
Figure 35. Output Sink Current vs.
0
0
I
0
src
Low Side
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
I
src
20
20
20
Temperature
Temperature
BOOT
High Side
40
40
40
= VDRV_HI = 600 V)
60
60
60
I
src
80
80
80
High Side
100
100 120
100 120
120